EP 0205570 B1 19930929 - A COMPOUND DIELECTRIC MULTI-CONDUCTOR TRANSMISSION LINE
Title (en)
A COMPOUND DIELECTRIC MULTI-CONDUCTOR TRANSMISSION LINE
Publication
Application
Priority
- US 68353584 A 19841219
- US 80153385 A 19851127
- US 80153485 A 19851127
- US 80153585 A 19851127
- US 80153685 A 19851127
- US 80153785 A 19851127
Abstract (en)
[origin: WO8603891A2] A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness ds and permittivity epsilon s; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity epsilon g, where epsilon g > epsilon s, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness dl, and permittivity epsilon l, where epsilon g > epsilon l, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide band. Radiation losses due to coupling of the desired mode to the substrate modes and the conductors are furthermore reduced and the polarization of the dominant mode is such as to render said structure relatively insensitive to small deviations from parallelism among the different interfaces.
IPC 1-7
H01P 1/10; H01P 1/20; H01P 1/37; H01P 1/38; H01P 3/08; H01P 5/08; H01Q 13/24; H01Q 13/28
IPC 8 full level
H01P 1/10 (2006.01); H01P 1/20 (2006.01); H01P 1/32 (2006.01); H01P 1/37 (2006.01); H01P 1/38 (2006.01); H01P 3/08 (2006.01); H01P 3/16 (2006.01); H01P 5/08 (2006.01); H01Q 13/20 (2006.01); H01Q 13/24 (2006.01); H01Q 13/28 (2006.01)
CPC (source: EP)
H01P 1/10 (2013.01); H01P 1/32 (2013.01); H01P 3/082 (2013.01); H01P 3/16 (2013.01); H01Q 13/20 (2013.01)
Citation (examination)
- US 4463330 A 19840731 - YONEYAMA TSUKASA [JP]
- IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, vol. MTT-29, no.10, October 1981, IEEE, New York, US; R.SIMONS: "Suspended slot line using doublelayer dielectric", pages 1102-1109
- MICROWAVE JOURNAL, vol. 25, no.9, September 1982, Horizon House, Dedham, Ma., US; I.ITOH: "Open guiding structures for mmW integrated circuits", pages 113-114, 116, 118, 120, 122, 124-126
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 8603891 A2 19860703; WO 8603891 A3 19880114; DE 3587607 D1 19931104; DE 3587607 T2 19940210; EP 0205570 A1 19861230; EP 0205570 B1 19930929
DOCDB simple family (application)
US 8502423 W 19851212; DE 3587607 T 19851212; EP 86900457 A 19851212