EP 0207981 A4 19870706 - COMPOSITIONS OF POLY(IMIDES) HAVING PHENYLINDANE DIAMINES AND/OR DIANHYDRIDE MOIETIES IN THE POLY(IMIDE) BACKBONE.
Title (en)
COMPOSITIONS OF POLY(IMIDES) HAVING PHENYLINDANE DIAMINES AND/OR DIANHYDRIDE MOIETIES IN THE POLY(IMIDE) BACKBONE.
Title (de)
ZUSAMMENSETZUNGEN VON POLYIMIDEN MIT PHENYLINDANDIAMINEN UND/ODER DIANHYDRIDGRUPPIERUNGEN IM POLYIMIDSKELETT.
Title (fr)
COMPOSITIONS DE POLY(IMIDES) POSSEDANT DES DIAMINES DE PHENYLINDANE ET/OU DES MOITIES DE DIANHYDRIDE DANS LA COLONNE VERTEBRALE DU POLY(IMIDE).
Publication
Application
Priority
US 68878385 A 19850104
Abstract (en)
[origin: WO8604079A1] Novel compositions of a poly(imide) selected from poly(imides) having phenylindane diamine and/or dianhydride moieties in the poly(imide) backbone and a polymeric component comprising: a) a poly(etherimide); b) a poly(sulfone); c) a poly(aryl ether ketone); d) a poly(carbonate); or e) a poly(arylate); and the compositions which have been cured. The compositions are useful as adhesives, coatings and matrix resins for fiber reinforced composites. The invention also relates to a multi-layered article for use in electronic devices, the article comprising a plurality of layers each comprising a cured composition of the invention with one or more intervening layers of conductive or semi-conductive material.
IPC 1-7
C08L 69/00; C08L 71/04; C08L 77/00; C08G 65/48; C09J 3/14; B05D 3/02
IPC 8 full level
B05D 7/24 (2006.01); C08K 7/02 (2006.01); C08L 67/02 (2006.01); C08L 69/00 (2006.01); C08L 71/00 (2006.01); C08L 71/08 (2006.01); C08L 71/12 (2006.01); C08L 79/08 (2006.01); C08L 81/00 (2006.01); C08L 81/06 (2006.01); C08L 101/00 (2006.01); C09D 5/24 (2006.01); C09D 169/00 (2006.01); C09D 179/08 (2006.01); C09J 167/00 (2006.01); C09J 179/08 (2006.01); H01B 3/30 (2006.01); H01L 23/12 (2006.01); H05K 1/03 (2006.01)
CPC (source: EP)
C08L 79/08 (2013.01); C08L 101/00 (2013.01)
Citation (search report)
- No relevant documents have been disclosed.
- See references of WO 8604079A1
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI NL SE
DOCDB simple family (publication)
WO 8604079 A1 19860717; EP 0207981 A1 19870114; EP 0207981 A4 19870706; JP S62501370 A 19870604
DOCDB simple family (application)
US 8502588 W 19851231; EP 86900703 A 19851231; JP 50061386 A 19851231