EP 0208808 A1 19870121 - Printed resistor, method for making same and application thereof.
Title (en)
Printed resistor, method for making same and application thereof.
Title (de)
Gedruckter Widerstand, Verfahren zur Herstellung und Anwendung.
Title (fr)
Résistance imprimée, sa méthode de fabrication et son application.
Publication
Application
Priority
- CN 85105318 A 19850711
- CN 85202831 U 19850711
Abstract (en)
A conductive paint made up of an adhesive, a diluent and conductive particles is applied onto an insulating substrate (1) according to a certain pattern to form a resistive layer (2). The resistive structure so formed can be used in electronic and electric circuits, or as an electrical-thermal energy transforming apparatus.
IPC 1-7
IPC 8 full level
H01C 7/00 (2006.01); H01C 17/065 (2006.01); H05B 3/12 (2006.01); H05B 41/00 (2006.01)
CPC (source: EP)
H01C 7/003 (2013.01); H01C 17/065 (2013.01); H05B 3/12 (2013.01); H05B 41/00 (2013.01)
Citation (search report)
- [X] GB 690478 A 19530422 - WARD BLENKINSOP & CO LTD, et al
- [A] DE 2401784 A1 19750724 - SIBIRSK NII ENERGETIKI
- [A] FR 1579597 A 19690829 - ACEC [BE]
- [A] DE 1765774 A1 19710826 - ROEDERSTEIN KONDENSATOREN
- [X] JEE, JOURNAL OF ELECTRONIC ENGINEERING, vol. 19, no. 188, August 1982, pages 88-91, Tokyo, JP; K. SOGABE: "Thick-film resistor networks: their materials, trimming and production process"okage 88 - page 89, left-hand column, paragraph 1; figure 1
- [X] MICROELECTRONICS JOURNAL, vol. 12, no. 2, March/April 1981, pages 32-34, Kirkcaldy, Scotland, GB; A.K. MATKARI et al.: "A novel approach for higher yield in thick-film resistors"
Designated contracting state (EPC)
BE CH DE FR GB IT LI SE
DOCDB simple family (publication)
DOCDB simple family (application)
EP 85110374 A 19850819