EP 0210436 A1 19870204 - Process for metallizing ceramic materials.
Title (en)
Process for metallizing ceramic materials.
Title (de)
Verfahren zur Metallisierung von Keramik.
Title (fr)
Procédé de métallisation de matières céramiques.
Publication
Application
Priority
DE 3523957 A 19850704
Abstract (en)
[origin: US4812202A] The present invention relates to a process for wet metal-plating of ceramic substrates. More particularly this invention relates to the wet chemical copper plating of Al2O3 ceramics. It is essentially composed of a combined chemical pretreatment of the ceramic surface for chemical metallization without external electric current in such a manner that within only a single pretreatment step the substrate surface is chemically activated and is simultaneously covered with an adhesion promoter, and/or a sensitizer and/or an activator (catalyst).
Abstract (de)
Die Erfindung betrifft ein Verfahren zur Metallisierung von Keramik, insbesondere zur naßchemischen Verkupferung von Al2O3-Keramik. Es besteht im wesentlichen aus einer kombinierten chemischen Vorbehandlung der Keramikoberfläche zur außenstromlosen chemischen Metallisierung, und zwar derart. daß in einem Vorbehandlungsschritt gleichzeitig die chemische Aktivierung der Substratoberfläche und deren Belegung mit einem Haftvermittler und/oder Sensibilisator und/oder Aktivator (Katalysator) erfolgt.
IPC 1-7
IPC 8 full level
C04B 41/88 (2006.01); C23C 18/18 (2006.01); H05K 3/38 (2006.01); H05K 1/03 (2006.01); H05K 3/18 (2006.01)
CPC (source: EP US)
C23C 18/1865 (2013.01 - EP US); C23C 18/1879 (2013.01 - EP US); H05K 3/381 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US); H05K 3/181 (2013.01 - EP US)
Citation (search report)
- [X] EP 0035626 A1 19810916 - SES INC [US]
- [X] EP 0128476 A2 19841219 - KOLLMORGEN TECH CORP [US]
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI LU NL SE
DOCDB simple family (publication)
EP 0210436 A1 19870204; EP 0210436 B1 19910904; AT E66967 T1 19910915; DE 3523957 A1 19870108; DE 3681221 D1 19911010; JP H0223512 B2 19900524; JP S627687 A 19870114; US 4812202 A 19890314
DOCDB simple family (application)
EP 86108643 A 19860625; AT 86108643 T 19860625; DE 3523957 A 19850704; DE 3681221 T 19860625; JP 15429686 A 19860702; US 88525486 A 19860707