EP 0212764 A3 19890208 - HIGH DENSITY, CONTROLLED IMPEDANCE CONNECTOR
Title (en)
HIGH DENSITY, CONTROLLED IMPEDANCE CONNECTOR
Publication
Application
Priority
US 76270685 A 19850805
Abstract (en)
[origin: EP0212764A2] A high density electrical connector is shown in which discrete dielectric wafers mount several contact elements within grooves on a first surface of the wafer while mounting a single ground plane within a recess on a second surface. This configuration, when the wafers are stacked side-by-side, forms the contacts in a stripline connection in which the impedance of each contact may be controlled. The wafers may be inserted into slots within a housing to form a high density connector for joining a daughter board to a mother board.
IPC 1-7
IPC 8 full level
H01R 13/658 (2011.01); H01R 13/72 (2006.01)
CPC (source: EP)
H01R 12/00 (2013.01); H01R 12/721 (2013.01); H01R 13/6587 (2013.01)
Citation (search report)
- [Y] US 3601772 A 19710824 - MANCINI LLOYD
- [Y] US 3601753 A 19710824 - UBERBACHER EDWARD C
- [A] GB 1001569 A 19650818 - BROWN ENGINEERING COMPANY INC
- [AD] US 3401369 A 19680910 - PALMATEER PAUL H, et al
- [A] US 4469389 A 19840904 - GRABBE DIMITRY [US], et al
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0212764 A2 19870304; EP 0212764 A3 19890208; CA 1244531 A 19881108; JP S6235472 A 19870216
DOCDB simple family (application)
EP 86300288 A 19860117; CA 493753 A 19851024; JP 9318586 A 19860421