EP 0215649 B1 19910123 - PLATINUM/ECA-1500 COMBINATION ANODE COATING FOR LOW PH HIGH CURRENT DENSITY ELECTROCHEMICAL PROCESS ANODES
Title (en)
PLATINUM/ECA-1500 COMBINATION ANODE COATING FOR LOW PH HIGH CURRENT DENSITY ELECTROCHEMICAL PROCESS ANODES
Publication
Application
Priority
US 77591185 A 19850913
Abstract (en)
[origin: EP0215649A1] An anode for use in electroforming copper foil is formed by depositing a multilayer coating on a substrate of a film forming metal. At least one interior layer consists essentially of substantially pore free platinum which is applied electrolytically to a thickness of at least about 5 micrometers (about 200 microinches), and then densified by heat treating in an oxygen containing atmosphere at from 600 to 775 DEG C. At least one of the exterior layers consists essentially of at least 97% iridium oxide and up to about 3% rhodium oxide, which is applied by thermal decomposition of thermally decomposable platinum group metal compounds in an oxygen containing atmosphere at a temperature of not more than about 600 DEG C.
IPC 1-7
IPC 8 full level
C25D 5/50 (2006.01); C23C 20/04 (2006.01); C25B 11/04 (2006.01); C25B 11/08 (2006.01); C25C 7/02 (2006.01); C25D 1/00 (2006.01); C25D 3/38 (2006.01); C25D 17/10 (2006.01); C25D 17/12 (2006.01)
CPC (source: EP)
C25B 11/091 (2021.01); C25C 7/02 (2013.01); C25D 17/10 (2013.01)
Citation (examination)
PATENT ABSTRACTS OF JAPAN, unexamined application, E section, vol. 1, no. 37, April 18, 1977 THE PATENT OFFICE JAPANESE GOVERNMENT, page 2034 E 76, Kokai-no. 51-133 789 (KIYOTERU TAKAYASU)
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI LU NL SE
DOCDB simple family (publication)
EP 0215649 A1 19870325; EP 0215649 B1 19910123; AT E60374 T1 19910215; CA 1305447 C 19920721; DE 3677108 D1 19910228; JP H0735597 B2 19950419; JP S6280298 A 19870413
DOCDB simple family (application)
EP 86307039 A 19860912; AT 86307039 T 19860912; CA 518078 A 19860912; DE 3677108 T 19860912; JP 21082986 A 19860909