EP 0222888 A1 19870527 - COMPOSITION AND METHOD FOR INHIBITING THE CURE OF CYANOACRYLATE ADHESIVES AND CURE INHIBTED CYANOACRYLATE ADHESIVE COMPOSITIONS.
Title (en)
COMPOSITION AND METHOD FOR INHIBITING THE CURE OF CYANOACRYLATE ADHESIVES AND CURE INHIBTED CYANOACRYLATE ADHESIVE COMPOSITIONS.
Title (de)
ZUSAMMENSETZUNG UND VERFAHREN ZUR VERHINDERUNG DER AUSHÄRTUNG VON CYANOACRYLATKLEBSTOFFEN UND AUSHÄRTUNGSGEHINDERTE ZUSAMMENSETZUNGEN VON CYANOACRYLATKLEBSTOFFEN.
Title (fr)
COMPOSITION ET PROCEDE D'INHIBITION DU DURCISSEMENT D'ADHESIFS EN CYANOACRYLATE ET COMPOSITIONS ADHESIVES EN CYANOACRYLATE A DURCISSEMENT INHIBE.
Publication
Application
Priority
US 73544085 A 19850517
Abstract (en)
[origin: WO8606738A1] Compositions and methods for inhibiting the cure of cyanoacrylate adhesives and cure inhibited cyanoacrylate adhesive compositions. The cure inhibited compositions comprise an organic carboxylic acid; and a hydrated or anhydrous metal chloride, fluoride, bromide or iodide.
Abstract (fr)
L'invention concerne des compositions et des procédés d'inhibition du durcissement d'adhésifs en cyanoacrylate et des compositions adhésives en cyanoacrylate à durcissement inhibé. Les compositions à durcissement inhibé comprennent un acide carboxylique organique et un chlorure, fluorure, bromure ou iodure métallique hydraté ou anhydre.
IPC 1-7
C09K 3/00; H01B 1/02; C08F 20/42; C08F 4/06; C08J 3/14; C08J 3/16; C08L 37/00; C08L 39/00; H01C 13/00
IPC 8 full level
C09K 3/10 (2006.01); C08F 2/00 (2006.01); C08F 2/38 (2006.01); C08F 4/06 (2006.01); C08F 20/42 (2006.01); C08F 22/32 (2006.01); C08J 3/14 (2006.01); C09J 4/00 (2006.01); C09J 4/04 (2006.01)
CPC (source: EP KR)
C08F 22/32 (2013.01 - KR); C09J 4/00 (2013.01 - EP); C09K 3/00 (2013.01 - KR)
C-Set (source: EP)
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI LU NL SE
DOCDB simple family (publication)
WO 8606738 A1 19861120; EP 0222888 A1 19870527; EP 0222888 A4 19890216; JP S63500247 A 19880128; KR 880700040 A 19880215; KR 910001027 B1 19910219
DOCDB simple family (application)
US 8601047 W 19860514; EP 86903816 A 19860514; JP 50298586 A 19860514; KR 870700035 A 19870117