EP 0224522 B1 19910227 - METHOD FOR METAL FORMING WITHOUT CUTTING
Title (en)
METHOD FOR METAL FORMING WITHOUT CUTTING
Publication
Application
Priority
DE 3519078 A 19850528
Abstract (en)
[origin: WO8607087A1] Method for non-cutting forming of metals using polymerizates in the form of homo- and copolymerizates of 1-olefins, oxidants of said homo- or copolymerizates, or saponification or esterification products of said oxidants as lubricants. The polymerizates are solids and have preferably melting points higher than 100<o>C and melting viscosities higher than 100 mPa.s at 170<o>C, the acid index of the oxidants being higher than 5. Said lubricants are used in the form of pure solid or in the form of compositions wherein they are mixed with additives and/or suspension agents, dispersion agents or solvents known per se.
IPC 1-7
C10M 107/00; C10M 107/18; C10N 40/24; C10N 50/00; C10N 60/00; C10N 70/00
IPC 8 full level
C10M 107/00 (2006.01); C10M 107/02 (2006.01); C10M 107/18 (2006.01); C10N 20/00 (2006.01); C10N 20/02 (2006.01); C10N 20/04 (2006.01); C10N 40/20 (2006.01); C10N 40/24 (2006.01); C10N 60/04 (2006.01); C10N 80/00 (2006.01)
CPC (source: EP US)
C10M 107/02 (2013.01 - EP US); C10M 107/18 (2013.01 - EP US); C10M 2205/00 (2013.01 - EP US); C10M 2205/022 (2013.01 - EP US); C10M 2205/024 (2013.01 - EP US); C10M 2205/026 (2013.01 - EP US); C10M 2205/028 (2013.01 - EP US); C10M 2205/14 (2013.01 - EP US); C10M 2207/28 (2013.01 - EP US); C10M 2207/40 (2013.01 - EP US); C10M 2207/404 (2013.01 - EP US); C10N 2020/01 (2020.05 - EP US); C10N 2040/24 (2013.01 - EP US); C10N 2040/241 (2020.05 - EP US); C10N 2040/242 (2020.05 - EP US); C10N 2040/243 (2020.05 - EP US); C10N 2040/244 (2020.05 - EP US); C10N 2040/245 (2020.05 - EP US); C10N 2040/246 (2020.05 - EP US); C10N 2040/247 (2020.05 - EP US); C10N 2050/02 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI LU NL SE
DOCDB simple family (publication)
DE 3519078 A1 19861204; DE 3677723 D1 19910404; EP 0224522 A1 19870610; EP 0224522 B1 19910227; JP S62503038 A 19871203; US 4800033 A 19890124; WO 8607087 A1 19861204
DOCDB simple family (application)
DE 3519078 A 19850528; DE 3677723 T 19860527; EP 8600318 W 19860527; EP 86903351 A 19860527; JP 50310086 A 19860527; US 2294887 A 19870127