Global Patent Index - EP 0228004 A3

EP 0228004 A3 19881130 - ELECTRICALLY CONDUCTIVE FLOOR CONSTRUCTION

Title (en)

ELECTRICALLY CONDUCTIVE FLOOR CONSTRUCTION

Publication

EP 0228004 A3 19881130 (DE)

Application

EP 86117324 A 19861212

Priority

DE 3545760 A 19851221

Abstract (en)

[origin: US4770916A] An electrically conductive flooring and method for constructing same upon an existing flooring, which comprises sequential layers of: a nonwoven base layer; an electrically conductive coating layer; an electrically conductive adhesive layer; and an antistatic or electrically conductive top layer; a copper band is optionally located within the coating layer and/or adhesive layer.

IPC 1-7

H05F 3/02; E04F 15/16; E04F 15/02

IPC 8 full level

E04F 15/02 (2006.01); E04F 15/16 (2006.01); H05F 3/02 (2006.01)

CPC (source: EP US)

E04F 15/02 (2013.01 - EP US); H05F 3/025 (2013.01 - EP US); Y10T 428/1424 (2015.01 - EP US); Y10T 428/23979 (2015.04 - EP US); Y10T 428/24917 (2015.01 - EP US); Y10T 428/30 (2015.01 - EP US); Y10T 442/2861 (2015.04 - EP US); Y10T 442/697 (2015.04 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE CH DE FR GB IT LI LU NL SE

DOCDB simple family (publication)

EP 0228004 A2 19870708; EP 0228004 A3 19881130; EP 0228004 B1 19920122; AT E72086 T1 19920215; DE 3545760 A1 19870625; DE 3545760 C2 19891005; DE 3683616 D1 19920305; US 4770916 A 19880913

DOCDB simple family (application)

EP 86117324 A 19861212; AT 86117324 T 19861212; DE 3545760 A 19851221; DE 3683616 T 19861212; US 94426486 A 19861219