EP 0231790 A2 19870812 - Process for fabricating laminated structures of improved structural integrity.
Title (en)
Process for fabricating laminated structures of improved structural integrity.
Title (de)
Herstellungsverfahren zum Schichtaufbau von verbesserter struktureller Integrität.
Title (fr)
Procédé de manufacture des structures laminées d'intégrité structural améliorée.
Publication
Application
Priority
US 82433586 A 19860130
Abstract (en)
This patent application discloses a process for fabricating printhead structures for use in thermal ink jet printers. In this process, a thin film resistor substrate (10) is bonded to a flat orifice plate (12) by means of an adhesive polymer (14) to which heat and pressure are applied for a predetermined time. This pressure is applied to the outer surfaces of the orifice plate (12) and substrate (10) respectively and hydrostatically transmitted to the adhesive polymer (14) in such a manner as to apply pressure uniformly across the surface of the polymer (14). This application of uniform pressure is accomplished in spite of contours and other surface irregularities that may exist on either the materials being bonded or the heat staker members which apply heat and pressure to these members. In a preferred embodiment of the invention, the above hydrostatic transmission of pressure is accomplished by means of a "waterbed" sandwich structure (16) in which a liquifiable material (22) is enclosed between layers (18,20) of flexible foil material.
IPC 1-7
IPC 8 full level
B32B 43/00 (2006.01); B29C 43/32 (2006.01); B29C 65/02 (2006.01); B32B 37/10 (2006.01); B41J 2/16 (2006.01); B29L 9/00 (2006.01)
CPC (source: EP)
B41J 2/1601 (2013.01); B41J 2/1623 (2013.01)
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 0231790 A2 19870812; EP 0231790 A3 19890614; JP H0794165 B2 19951011; JP S62181148 A 19870808
DOCDB simple family (application)
EP 87100520 A 19870116; JP 1959887 A 19870129