EP 0233201 A4 19871130 - METHOD FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS.
Title (en)
METHOD FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS.
Title (de)
HERSTELLUNGSVERFAHREN VON GEDRUCKTEN SCHALTUNGEN.
Title (fr)
PROCEDE DE FABRICATION DE CARTES A CIRCUITS IMPRIMES.
Publication
Application
Priority
US 76381285 A 19850808
Abstract (en)
[origin: WO8700938A1] Printed circuit boards having solder coated pads and through-holes (140) and bare copper traces (160) protected by a directly applied solder mask (260) or by a coating of non-reflowable metal and a solder mask thereover, are manufactured by a process which avoids the need for tin-lead stripping and the need for separate application and leveling of molten solder. In the preferred process, liquid resists (240) are applied to circuit boards having tin-lead (220) over copper plated holes (140) and pads so as to define and etch-protect bare copper traces (160) of desired pattern circuitry (as well as other desired configurations). Copper areas other than those protected by the etch-resist (240) and tin-lead plating (220) are etched away, the etch-resist (240) removed and solder mask (260) applied over the bare copper traces (160) or other desired bare copper areas or, alternatively, to bare copper first coated with a non-reflowable metal. The tin-lead plating (220) is then preferably reflowed and solidified to provide the pads and through-holes with solder coating.
IPC 1-7
IPC 8 full level
H05K 3/24 (2006.01); H05K 3/34 (2006.01); H05K 3/42 (2006.01); H05K 3/06 (2006.01); H05K 3/28 (2006.01)
CPC (source: EP)
H05K 3/243 (2013.01); H05K 3/3473 (2013.01); H05K 3/427 (2013.01); H05K 3/064 (2013.01); H05K 3/244 (2013.01); H05K 3/28 (2013.01); H05K 2201/09736 (2013.01); H05K 2203/043 (2013.01)
Citation (search report)
- [X] GB 1410780 A 19751022 - EXACTA CIRCUITS LTD
- [X] CA 1054259 A 19790508 - GEN ELECTRIC CANADA
- [X] EP 0127794 A2 19841212 - ANT NACHRICHTENTECH [DE]
- See references of WO 8700938A1
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI LU NL SE
DOCDB simple family (publication)
WO 8700938 A1 19870212; AU 5956286 A 19870305; CA 1258138 A 19890801; EP 0233201 A1 19870826; EP 0233201 A4 19871130; JP S63500837 A 19880324
DOCDB simple family (application)
US 8601270 W 19860609; AU 5956286 A 19860609; CA 515260 A 19860801; EP 86904002 A 19860609; JP 50322886 A 19860609