EP 0233824 A3 19890614 - MICROCIRCUIT PACKAGE
Title (en)
MICROCIRCUIT PACKAGE
Publication
Application
Priority
US 83100586 A 19860219
Abstract (en)
[origin: EP0233824A2] A flat housing package for microcircuits constructed entirely of metal with a stainless steel, cold-rolled steel, 52 alloy, or KOVAR frame (10) and an alumina/copper alloy base (20) and the process for brazing the components to one another. The brazing process involves heating the frame (10) and (20) base in three different heating zones and permits brazing at temperatures above 800 DEG C. The package has good heat transfer characteristics and electrical connections between the microcircuit substrates and the housing can be reworked without disturbing the brazed seal between the frame and the base.
IPC 1-7
IPC 8 full level
H01L 21/50 (2006.01); H01L 23/047 (2006.01); H01L 23/06 (2006.01); H01P 1/00 (2006.01); H05K 5/00 (2006.01)
CPC (source: EP)
H01L 21/50 (2013.01); H01L 23/047 (2013.01); H01L 23/06 (2013.01); H05K 5/0091 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/01079 (2013.01)
Citation (search report)
- [A] EP 0114760 A1 19840801 - EUROP COMPOSANTS ELECTRON [FR]
- [A] FR 2436497 A1 19800411 - ISOTRONICS INC [US]
- [A] FR 2436498 A1 19800411 - ISOTRONICS INC [US]
- [A] FR 2532219 A1 19840302 - ISOTRONICS INC [US]
- [A] EP 0094869 A1 19831123 - THOMSON CSF [FR]
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0233824 A2 19870826; EP 0233824 A3 19890614; JP S62209843 A 19870916
DOCDB simple family (application)
EP 87400353 A 19870218; JP 3544687 A 19870218