Global Patent Index - EP 0237728 A3

EP 0237728 A3 19880615 - TOOL AND METHOD FOR ASSEMBLING A PRINTED CIRCUIT CARD

Title (en)

TOOL AND METHOD FOR ASSEMBLING A PRINTED CIRCUIT CARD

Publication

EP 0237728 A3 19880615 (EN)

Application

EP 87100926 A 19870123

Priority

US 84027386 A 19860317

Abstract (en)

[origin: EP0237728A2] This invention provides a tool and method for positioning connector springs (6) in a housing (7) and then holding them firmly in place while a tail or arm (63) that extends from each connector spring is soldered to a tab or pad (51) on the edge of a printed circuit card (5). The tool has a plurality of rubber protrusions (81), one for each connector spring in the assembly. These rubber protrusions are wedge shaped and they fit into the contacts (66, 67) on the connector springs to hold the connector springs firmly in an aligned position. Utilizing the method of the present invention the connector springs (6) are first loosely positioned in the holes in the housing assembly. The tool with the wedge shaped protrusions (81) is used to push the connector springs into their final position and to hold them in position during the soldering operation.

IPC 1-7

H05K 3/34

IPC 8 full level

H01R 12/04 (2006.01); H01R 12/71 (2011.01); H01R 43/02 (2006.01); H01R 43/20 (2006.01)

CPC (source: EP)

H01R 43/205 (2013.01)

Citation (search report)

  • [A] FR 2550664 A1 19850215 - AUGAT INC [US]
  • [AD] IBM TECHNICAL DISCLOSURE BULLETIN, vol. 25, no. 3B, August 182, pages 1410-1411, New York, US; O.I. CHIRINO et al.: "Semi-automatic card inserton device"
  • [AD] IBM TECHNICAL DISCLOSURE BULLETIN, vol. 18, no. 8, January 1976, page 2460, New York, US; R.L. AGARD et al.: "Offset contact blade carrier"

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 0237728 A2 19870923; EP 0237728 A3 19880615; EP 0237728 B1 19910424; DE 3769501 D1 19910529; JP H0377633 B2 19911211; JP S62226591 A 19871005

DOCDB simple family (application)

EP 87100926 A 19870123; DE 3769501 T 19870123; JP 3258987 A 19870217