EP 0240589 B1 19900207 - PROCESS AND APPARATUS FOR REGENERATING AN ELECTROLESS COPPER-PLATING BATH
Title (en)
PROCESS AND APPARATUS FOR REGENERATING AN ELECTROLESS COPPER-PLATING BATH
Publication
Application
Priority
EP 86105002 A 19860411
Abstract (en)
[origin: US4734175A] A process and an apparatus are described for regenerating an electroless copper plating bath containing a complexing agent, preferably ethylenediamine tetraacetic acid. From the bath solution to be regenerated, the copper content is reduced by electrolysis to a value below 20 mg/l and the complexing agent subsequently precipitated by acidification and recovered. After dissolution in an alkaline electrolytic solution, the solution thus obtained is fed back to the electroless copper plating bath. A particularly pure ethylenediamine tetraacetic acid free from by-products is obtained if the pH value is kept constant during electrolysis, an anodic current density i+ of 100 A/m2 is not exceeded, and the anodic current density during electrolysis is reduced according to the electrolysis characteristic or in steps.
IPC 1-7
IPC 8 full level
C23C 18/16 (2006.01); C23C 18/40 (2006.01)
CPC (source: EP US)
C23C 18/1617 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 0240589 A1 19871014; EP 0240589 B1 19900207; DE 3668914 D1 19900315; JP H0236677 B2 19900820; JP S62243776 A 19871024; US 4734175 A 19880329
DOCDB simple family (application)
EP 86105002 A 19860411; DE 3668914 T 19860411; JP 3596387 A 19870220; US 3338787 A 19870402