Global Patent Index - EP 0245325 B1

EP 0245325 B1 19901128 - ADHESIVE APPLICATION PROCESS

Title (en)

ADHESIVE APPLICATION PROCESS

Publication

EP 0245325 B1 19901128 (DE)

Application

EP 86906322 A 19861025

Priority

DE 3538897 A 19851102

Abstract (en)

[origin: WO8702624A1] In order to be able to use, in the production of books, humidifying PUR melting adhesive systems for the binding of the body of the book and the cover (1), the adhesive is applied to the cover (1) in a width which exceeds the thickness of the back of the book on both sides by about 0.5 to 20 mm.

IPC 1-7

B42C 9/00

IPC 8 full level

B42C 7/00 (2006.01); B42C 9/00 (2006.01); B42D 3/00 (2006.01)

CPC (source: EP US)

B42C 7/00 (2013.01 - EP US); B42D 3/002 (2013.01 - EP US); Y10S 156/908 (2013.01 - EP US); Y10T 156/1034 (2015.01 - EP US); Y10T 428/31591 (2015.04 - EP US)

Designated contracting state (EPC)

AT BE CH DE FR GB IT LI NL SE

DOCDB simple family (publication)

WO 8702624 A1 19870507; DE 3538897 A1 19870507; DE 3675937 D1 19910110; EP 0245325 A1 19871119; EP 0245325 B1 19901128; JP H01501610 A 19890608; US 4984949 A 19910115

DOCDB simple family (application)

EP 8600616 W 19861025; DE 3538897 A 19851102; DE 3675937 T 19861025; EP 86906322 A 19861025; JP 50594086 A 19861025; US 35589589 A 19890519