Global Patent Index - EP 0247617 A2

EP 0247617 A2 19871202 - Multilayer ceramic substrate with circuit patterns.

Title (en)

Multilayer ceramic substrate with circuit patterns.

Title (de)

Keramisches Mehrschichtsubstrat mit Schaltungsmustern.

Title (fr)

Substrat multi-couche en céramique ayant une configuration de circuits.

Publication

EP 0247617 A2 19871202 (EN)

Application

EP 87107771 A 19870527

Priority

JP 12214786 A 19860529

Abstract (en)

A multilayer ceramic substrate with circuit patterns in which Ag conductor patterns having a sheet resistivity lower than 3 milliohms/square are formed inside the substrate by co-firing with green ceramic sheets and Au conductor patterns are formed onto the surface of the substrate in such a way that said Au conductor patterns are electrically connected with said Ag conductor patterns. In such an arrangement, high reliable multilayer substrates can be readily obtained without increasing production cost, while maintaining superior properties of Au. If desired, a metal layer different from the foregoing conductor patterns may be interposed between the Ag conductor pattern and the Au conductor pattern. The metal layer prevents diffusion of Ag to the Au conductor patterns and provides much higher improvements anti-migration property and reliability.

IPC 1-7

H01L 23/52; H01L 21/48

IPC 8 full level

H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H05K 3/24 (2006.01); H05K 3/46 (2006.01)

CPC (source: EP)

H01L 21/4857 (2013.01); H01L 23/49866 (2013.01); H01L 23/5383 (2013.01); H01L 24/29 (2013.01); H05K 3/248 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83805 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/19105 (2013.01); H05K 3/4629 (2013.01)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 0247617 A2 19871202; EP 0247617 A3 19881123; JP H0569319 B2 19930930; JP S62279695 A 19871204

DOCDB simple family (application)

EP 87107771 A 19870527; JP 12214786 A 19860529