EP 0251158 A2 19880107 - Device for contacting a substrate.
Title (en)
Device for contacting a substrate.
Title (de)
Vorrichtung zum Kontaktieren eines Substrats.
Title (fr)
Dispositif pour établir un contact avec un substrat.
Publication
Application
Priority
DE 3622116 A 19860702
Abstract (en)
A device for contacting a substrate, preferably an electrical conductor, with spring parts that are in contact with the substrate at a plurality of points. Substrates of different diameters can be contacted without problem and for electrical conductors a high HF-impermeability is guaranteed. The device comprises at least one helical spring (5) arranged substantially annularly in a housing (1), with the helical windings (9) of the spring inclined at an angle alpha to the radial plane (10) perpendicular to the contact axis (11) When different sized substrates are inserted the windings turn, changing the angle alpha . This requires little force. Also the spacing of adjacent helical windings is maintained so that for electrical conductor substrates the same high HF impermeability is guaranteed for all conductor diameters.
IPC 1-7
IPC 8 full level
H01R 13/187 (2006.01)
CPC (source: EP)
H01R 13/187 (2013.01); H01R 24/38 (2013.01)
Designated contracting state (EPC)
BE CH DE ES FR GB LI NL SE
DOCDB simple family (publication)
EP 0251158 A2 19880107; EP 0251158 A3 19891018; DE 3622116 A1 19880114
DOCDB simple family (application)
EP 87109022 A 19870623; DE 3622116 A 19860702