EP 0251780 B1 19900816 - APPLYING DESIGNS FROM HEAT-RELEASE TRANSFERS BY MEANS OF A TRANSFER PAD
Title (en)
APPLYING DESIGNS FROM HEAT-RELEASE TRANSFERS BY MEANS OF A TRANSFER PAD
Publication
Application
Priority
GB 8616177 A 19860702
Abstract (en)
[origin: EP0251780A1] Design layers from heat-release transfers are applied to surfaces of articles of ceramic ware (W) utilising a deformable transfer pad (18). The surface of the transfer pad is heated by bringing together the pad and a pad-heating platen 12, whose surface is maintained at a suitable elevated temperature, and separating the pad and the surface after a suitable heating period. A heat-release transfer (T) is presented on a presenting platen (10), with at least the adhesive between the design layer and the backing sheet of the transfer not yet activated, and the heated pad pressed against the transfer on the platen. The pad is maintained pressed against the transfer for sufficient time for heat from the pad to activate the adhesive of the transfer, and the pad is then raised from the platen with the design layer of the transfer attached to the surface of the pad and with the backing sheet remaining on the platen. The pad bearing the design layer is then pressed against an article to be decorated (W) on a ware support (22) to apply the design layer to the surface of the article.
IPC 1-7
IPC 8 full level
B41F 17/34 (2006.01); B44C 1/17 (2006.01); B65C 9/25 (2006.01); B65C 9/36 (2006.01)
CPC (source: EP)
B44C 1/172 (2013.01); B65C 9/25 (2013.01); B65C 9/36 (2013.01)
Designated contracting state (EPC)
CH DE FR IT LI SE
DOCDB simple family (publication)
EP 0251780 A1 19880107; EP 0251780 B1 19900816; DE 3764328 D1 19900920; GB 2193158 A 19880203; GB 2193158 B 19900919; GB 8616177 D0 19860806; GB 8715441 D0 19870805; JP S6334141 A 19880213
DOCDB simple family (application)
EP 87305827 A 19870701; DE 3764328 T 19870701; GB 8616177 A 19860702; GB 8715441 A 19870701; JP 16623687 A 19870702