EP 0252295 A3 19890315 - COPPER-ETCHING SOLUTIONS
Title (en)
COPPER-ETCHING SOLUTIONS
Publication
Application
Priority
DE 3623504 A 19860709
Abstract (en)
[origin: US4849124A] An aqueous copper etching solution is disclosed, containing customary acid etching means based upon iron chloride, copper chloride or peroxide compounds, characterized by an additional content of halogen compounds, preferably of the formula AX, in which A is hydrogen, ammonium or a univalent metal equivalent, and X is a halogen atom, and also a process for the adhesive application of contacts onto conductor plates having one or more metal cores, in particular iron-nickel or iron-cobalt cores, including the steps of etching the conductor plates with the mentioned copper etching solution, with or without an addition of organic compounds based upon aliphatic amines or alcohols, thioureas, aromatic thio-compounds, pyridinium compounds, pyrimidinium compounds, alkoxylated alcohols or phenols, at room temperature, then rinsing, activating and chemically metallizing the conductor plates. The contacted conductor plates prepared in this manner are employed in electronics and electrical engineering.
IPC 1-7
IPC 8 full level
C23F 1/18 (2006.01)
CPC (source: EP US)
C23F 1/18 (2013.01 - EP US)
Citation (search report)
- [X] DE 1232984 B 19670126 - FMC CORP
- [X] DE 2557269 A1 19770630 - LICENTIA GMBH
- [X] FR 2251631 A1 19750613 - TOKAI ELECTRO CHEMICAL CO [JP]
- [X] DE 2942504 A1 19810430 - BOSCH GMBH ROBERT [DE]
- [A] GB 2131454 A 19840620 - NAUMOV JURY IVANOVICH, et al
- [A] US 3756957 A 19730904 - SHIGA S
- [A] DE 2739494 A1 19790308 - KOLBE & CO HANS
Designated contracting state (EPC)
BE CH DE ES FR GB IT LI LU NL SE
DOCDB simple family (publication)
EP 0252295 A2 19880113; EP 0252295 A3 19890315; DE 3623504 A1 19880121; JP S6326385 A 19880203; US 4849124 A 19890718
DOCDB simple family (application)
EP 87108025 A 19870603; DE 3623504 A 19860709; JP 16797587 A 19870707; US 7086587 A 19870701