EP 0253886 A1 19880127 - INTERCONNECTS FOR WAFER-SCALE-INTEGRATED ASSEMBLY.
Title (en)
INTERCONNECTS FOR WAFER-SCALE-INTEGRATED ASSEMBLY.
Title (de)
VERBINDUNGEN FÜR DEN ZUSAMMENBAU VON GESAMTSCHEIBEN INTEGRIERTER SCHALTUNGEN.
Title (fr)
INTERCONNEXION POUR UN ENSEMBLE INTEGRE A L'ECHELLE D'UNE TRANCHE.
Publication
Application
Priority
US 82062486 A 19860121
Abstract (en)
[origin: WO8704566A1] An assembly is obtained by stacking plural wafer-scale-integrated boards made of silicon. Connections between levels of the assembly are made by optical signals transmitted directly through the silicon boards.
Abstract (fr)
Un ensemble est obtenu en empilant plusieurs plaques en silicium intégrées à l'échelle d'une tranche. Des connexions entre des niveaux de l'ensemble sont réalisées par des signaux optiques transmis directement au travers des plaques de silicium.
IPC 1-7
IPC 8 full level
H01L 25/00 (2006.01); G02B 6/43 (2006.01); H01L 23/52 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 31/167 (2006.01)
CPC (source: EP KR)
G02B 6/43 (2013.01 - EP); H01L 31/16 (2013.01 - KR); H01L 31/167 (2013.01 - EP)
Citation (search report)
See references of WO 8704566A1
Designated contracting state (EPC)
DE FR GB IT NL
DOCDB simple family (publication)
WO 8704566 A1 19870730; EP 0253886 A1 19880127; JP S63502315 A 19880901; KR 880701024 A 19880413
DOCDB simple family (application)
US 8602805 W 19861224; EP 87902022 A 19861224; JP 50205187 A 19861224; KR 870700843 A 19870918