EP 0265638 A3 19881005 - LITHOGRAPHIC IMAGE SIZE REDUCTION
Title (en)
LITHOGRAPHIC IMAGE SIZE REDUCTION
Publication
Application
Priority
US 92422386 A 19861028
Abstract (en)
[origin: EP0265638A2] Disclosed is a process for reducing lithographic image size for integrated circuit manufacture. A mask (14) of photosensitive material having an opening (20) of a minimum size (A) dictated by the limits of lithography is formed on a substrate (10). Reduction in the image size is achieved by establishing sidewalls (24) to the interior vertical surfaces of the opening by depositing a conformal layer (22), followed by anisotropic etching. The dimension (C) of the new opening is reduced by the combined thickness of the two opposite insulator sidewalls. In a specific direct application of the disclosed process, a photomask/stencil having a pattern of openings of a minimum size smaller than possible by lithography, per se, is formed.
IPC 1-7
IPC 8 full level
H01L 21/302 (2006.01); G03F 7/40 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01); H01L 21/266 (2006.01); H01L 21/30 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01)
CPC (source: EP US)
H01L 21/0337 (2013.01 - EP US); H01L 21/0338 (2013.01 - EP US); H01L 21/3086 (2013.01 - EP US); H01L 21/3088 (2013.01 - EP US); Y10S 438/947 (2013.01 - EP US); Y10T 428/24322 (2015.01 - EP US)
Citation (search report)
- EP 0010596 A1 19800514 - IBM [US]
- EP 0150597 A1 19850807 - TOSHIBA KK [JP]
- PATENT ABSTRACTS OF JAPAN, Vol. 9, No. 15 (E-291)(1738), January 22, 1985; & JP,A,59 163 829 (MATSUSHITA) 14-09-1984, whole Abstract.
- PATENT ABSTRACTS OF JAPAN, Vol. 9, No. 56 (E-302)(1779), March 12, 1985; & JP,A,59 197 137 (FUJITSU) 08-11-1984, whole Abstract.
- IBM Technical Disclosure Bulletin, Vol. 29, No. 6, November 1986, pages 2760-2761; New York, US, "Fabrication of sub-minimum lithography trench", whole article.
- IBM Technical Disclosure Bulletin, Vol. 29, No. 9, February 1987, pages 3928-3929; New York, US, "Advanced groundrule processing performed with currently available photolithographic tools", Figures 1,2; page 3929, paragraph 1.
Designated contracting state (EPC)
CH DE ES FR GB IT LI NL SE
DOCDB simple family (publication)
EP 0265638 A2 19880504; EP 0265638 A3 19881005; CA 1250669 A 19890228; CA 1260627 C 19890926; JP 2553078 B2 19961113; JP S63116430 A 19880520; US 4707218 A 19871117
DOCDB simple family (application)
EP 87113097 A 19870908; CA 549183 A 19871013; JP 11726387 A 19870515; US 92422386 A 19861028