Global Patent Index - EP 0270283 A2

EP 0270283 A2 19880608 - Solder connection device.

Title (en)

Solder connection device.

Title (de)

Lötverbindungsvorrichtung.

Title (fr)

Dispositif de connexion à soudage.

Publication

EP 0270283 A2 19880608 (EN)

Application

EP 87310241 A 19871119

Priority

US 93423786 A 19861120

Abstract (en)

A device for electrically connecting together two wires and sealing the joint comprises a dimensionally-recoverable sleeve (2) having a central solder insert (3) and end adhesive inserts (4,5). The adhesive inserts comprise a higher viscosity adhesive (5) that acts as a dam restricting flow of the lower viscosity adhesive (4).

IPC 1-7

H01R 4/72

IPC 8 full level

H01R 4/02 (2006.01); H01R 4/72 (2006.01)

CPC (source: EP US)

H01R 4/723 (2013.01 - EP US); Y10S 174/08 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE CH DE ES FR GB IT LI NL SE

DOCDB simple family (publication)

EP 0270283 A2 19880608; EP 0270283 A3 19900117; EP 0270283 B1 19920812; AT E79489 T1 19920815; DE 3781114 D1 19920917; DE 3781114 T2 19930325; JP S63146368 A 19880618; US 4832248 A 19890523

DOCDB simple family (application)

EP 87310241 A 19871119; AT 87310241 T 19871119; DE 3781114 T 19871119; JP 29498387 A 19871120; US 93423786 A 19861120