EP 0271163 B1 19910911 - MANUFACTURING METHOD OF ELECTRICAL CIRCUIT BOARDS
Title (en)
MANUFACTURING METHOD OF ELECTRICAL CIRCUIT BOARDS
Publication
Application
Priority
DE 3641995 A 19861209
Abstract (en)
[origin: EP0271163A2] The invention relates to a manufacturing method for electrical circuit boards which consist of a board-shaped plastic carrier and flat conductor tracks which are connected thereto and form a circuit pattern, which boards have contact points for components which make contact with them. The circuit pattern is cut from a copper plate in a cutting tool using cutting stamps and pressing pads, and is moulded into plastic, the plastic forming the board-shaped carrier. The copper plate is cut into only in a partial section while maintaining a structure which is still coherent consisting of the subsequent conductor tracks of the circuit pattern and empty tracks located between them. This structure of the copper plate is inserted in a plastic injection mould with spacers in the hollow space of the mould, the spacers pressing the conductor and empty tracks apart in the hollow space of the mould into at least two planes offset with respect to one another, in which the tracks are then held firmly by the spacers during the plastic injection process. <IMAGE>
IPC 1-7
IPC 8 full level
B29C 33/12 (2006.01); B29C 45/14 (2006.01); B29C 70/72 (2006.01); H05K 3/00 (2006.01); H05K 3/04 (2006.01); H05K 3/10 (2006.01); H05K 3/20 (2006.01); H05K 3/28 (2006.01); H05K 1/00 (2006.01); H05K 3/40 (2006.01)
CPC (source: EP)
B29C 33/12 (2013.01); B29C 45/14065 (2013.01); B29C 45/14221 (2013.01); B29C 45/14639 (2013.01); B29C 70/72 (2013.01); H05K 3/0014 (2013.01); H05K 3/041 (2013.01); H05K 3/202 (2013.01); B29C 2045/14122 (2013.01); B29K 2995/0005 (2013.01); H05K 1/0298 (2013.01); H05K 3/4092 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/0108 (2013.01)
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 0271163 A2 19880615; EP 0271163 A3 19881228; EP 0271163 B1 19910911; DE 3641995 C1 19880519; DE 3772944 D1 19911017; JP H02110991 A 19900424
DOCDB simple family (application)
EP 87202440 A 19871207; DE 3641995 A 19861209; DE 3772944 T 19871207; JP 30883587 A 19871208