EP 0280245 A2 19880831 - Method and apparatus for cutting a cylindrical material.
Title (en)
Method and apparatus for cutting a cylindrical material.
Title (de)
Verfahren und Vorrichtung für das Schneiden eines zylindrischen Materials.
Title (fr)
Procédé et dispositif pour le découpage d'un matériau cylindrique.
Publication
Application
Priority
- JP 105288 A 19880106
- JP 105388 A 19880106
- JP 4076487 A 19870224
- JP 4076587 A 19870224
- JP 4076687 A 19870224
Abstract (en)
Method and apparatus for cutting a cylindrical material (10, W) formed of silicone or the like which is an original material to produce semiconductor devices, using a rotary blade (12, 140). In the cutting method, the base end side of the cylindrical material is fixed and at the same time, before the cutting of the cylindrical material (10, W) is started, the cutting side of the cylindrical material (10, W) is also fixed according to the shape thereof. The cutting is performed while maintaining such fixed conditions until the cutting is completed.
IPC 1-7
IPC 8 full level
CPC (source: EP KR US)
B26D 1/14 (2013.01 - KR); B28D 1/22 (2013.01 - KR); B28D 5/0058 (2013.01 - EP US); B28D 5/0094 (2013.01 - EP US); B28D 5/028 (2013.01 - EP US); Y10T 83/0443 (2015.04 - EP US); Y10T 83/2185 (2015.04 - EP US); Y10T 83/7527 (2015.04 - EP US); Y10T 83/754 (2015.04 - EP US); Y10T 83/7553 (2015.04 - EP US); Y10T 83/7573 (2015.04 - EP US)
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 0280245 A2 19880831; EP 0280245 A3 19901024; EP 0280245 B1 19930908; DE 3883804 D1 19931014; DE 3883804 T2 19940120; KR 880009747 A 19881004; KR 930005466 B1 19930622; US 4903681 A 19900227
DOCDB simple family (application)
EP 88102589 A 19880222; DE 3883804 T 19880222; KR 880001932 A 19880224; US 15674888 A 19880218