EP 0298607 B1 19940413 - Outer tape automated bonding semiconductor package.
Title (en)
Outer tape automated bonding semiconductor package.
Title (de)
Halbleiterpackung mit automatischer Bandmontage.
Title (fr)
Empaquetage pour semi-conducteur à montage automatique sur bande.
Publication
Application
Priority
US 5905187 A 19870608
Abstract (en)
[origin: EP0298607A2] A semiconductor package (10) for protecting a semiconductor chip (32) such as a Very Large Scale Integration chip and connecting it to an electrical circuit is disclosed. The chip is bonded to a section of Tape Automated Bonding, (TAB), tape (20) which contains a number of leads (22) thereover, each lead has an inner lead section (24) bonded to the chip and an outer lead section (26) that extends beyond the outer perimeter of the tape, for connecting to the circuit. The chip is enclosed in a housing (18) which subtends an area slightly larger than the chip itself. The inner lead sections project from the TAB tape into the housing and are bonded to the chip. A metal layer (54) under the TAB tape is connected to a number of the leads. After the semiconductor package of this invention is assembled, the outer leads are attached to the associated circuit so as to connect the chip to the circuit. The metal layer serves as a reference plane so the leads connected thereto supply a voltage that does not vary to sub-circuits on the chip.
IPC 1-7
IPC 8 full level
H01L 23/04 (2006.01); H01L 21/60 (2006.01); H01L 23/498 (2006.01)
CPC (source: EP KR US)
H01L 21/60 (2021.08 - KR); H01L 23/4985 (2013.01 - EP US); H01L 23/50 (2013.01 - KR); H01L 24/86 (2013.01 - EP US); H01L 24/50 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US)
Citation (examination)
EP 0223699 A2 19870527 - FAIRCHILD SEMICONDUCTOR [US]
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 0298607 A2 19890111; EP 0298607 A3 19890906; EP 0298607 B1 19940413; AU 1745488 A 19881208; AU 608327 B2 19910328; CA 1279733 C 19910129; DE 3889018 D1 19940519; DE 3889018 T2 19940929; IL 86643 A0 19881130; IL 86643 A 19920216; JP H0191442 A 19890411; JP H0525390 B2 19930412; KR 890001182 A 19890318; KR 970003910 B1 19970322; US 4914741 A 19900403
DOCDB simple family (application)
EP 88305233 A 19880608; AU 1745488 A 19880607; CA 568779 A 19880607; DE 3889018 T 19880608; IL 8664388 A 19880606; JP 14145588 A 19880608; KR 880006820 A 19880608; US 5905187 A 19870608