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EP 0299099 B1 19910116 - METHOD OF MAKING SILVER/ME0 CONTACT PLATES WITH A WELDABLE OR SOLDERABLE BACKING

Title (en)

METHOD OF MAKING SILVER/ME0 CONTACT PLATES WITH A WELDABLE OR SOLDERABLE BACKING

Publication

EP 0299099 B1 19910116 (DE)

Application

EP 87110116 A 19870714

Priority

EP 87110116 A 19870714

Abstract (en)

[origin: EP0299099A1] Because of their high MeO component, such small contact plates cannot be directly soldered or welded onto contact carriers. For this purpose, such a small contact plate must be provided with a layer which can be soldered or welded. According to the invention, it is proposed that such a layer be applied in the course of hot-press plating (hot-press welding), in an inert gas or reducing atmosphere. <IMAGE>

IPC 1-7

H01H 1/02; H01H 11/04

IPC 8 full level

H01H 11/04 (2006.01)

CPC (source: EP)

H01H 11/045 (2013.01)

Designated contracting state (EPC)

AT BE CH DE FR GB LI NL SE

DOCDB simple family (publication)

EP 0299099 A1 19890118; EP 0299099 B1 19910116; AT E60163 T1 19910215; DE 3767487 D1 19910221

DOCDB simple family (application)

EP 87110116 A 19870714; AT 87110116 T 19870714; DE 3767487 T 19870714