Global Patent Index - EP 0299989 B1

EP 0299989 B1 1993-04-07 - HIGH DENSITY CIRCUIT PANEL SOCKET

Title (en)

HIGH DENSITY CIRCUIT PANEL SOCKET

Publication

EP 0299989 B1 (EN)

Application

EP 88900317 A

Priority

  • US 653887 A
  • US 684887 A

Abstract (en)

[origin: WO8805612A1] A socket connector (2) suitable for use in establishing interconnection to a plurality of closely spaced surface pad portions (108) of traces (106) on a circuit panel (100). This socket connector (2) is suitable for use with a high density single in-line memory module. The individual terminals (10) are edge stamped from a spring metal blank and inserted in closely spaced centerlines into cavities (50) in a housing (4). Each terminal (10) has a base (14) with a pair of cantilever beams (12, 12') extending upwardly from the base (14), each cantilever beam (12, 12') being curved at its upper end to form a shallow downwardly extending ramp edge (26, 26'). Insertion of a circuit panel (100) edgewise into the connector (2) biases the terminals (10) outwardly with the stresses primarily confined to the plane of the spring metal blank. The terminals (10) are inserted from above and positively retained within the housing (4). Low insertion forces, together with a wiping action between the terminals (10) and the surface pad portions (108) of traces (106) on the circuit panel (100) is achieved.

IPC 1-7

H01R 23/70

IPC 8 full level

H01R 12/82 (2011.01); H01R 33/97 (2006.01); H01R 12/71 (2011.01); H01R 12/72 (2011.01); H01R 13/422 (2006.01); H01R 13/52 (2006.01)

CPC

H01R 12/82 (2013.01); H01R 12/716 (2013.01); H01R 12/721 (2013.01); H01R 13/422 (2013.01); H01R 13/5227 (2013.01)

Designated contracting state (EPC)

DE FR GB IT NL

DOCDB simple family

WO 8805612 A1 19880728; DE 3785346 D1 19930513; DE 3785346 T2 19931104; EP 0299989 A1 19890125; EP 0299989 B1 19930407; JP 2683706 B2 19971203; JP H01501907 A 19890629