EP 0308134 A3 19901024 - SPECULAR MACHINING APPARATUS FOR PERIPHERAL EDGE PORTION OF WAFER
Title (en)
SPECULAR MACHINING APPARATUS FOR PERIPHERAL EDGE PORTION OF WAFER
Publication
Application
Priority
JP 23039987 A 19870914
Abstract (en)
[origin: EP0308134A2] There is provided a specular machining apparatus for a peripheral edge portion of a semiconductor wafer comprising a chuck table having a chuck means for holding a wafer whose peripheral edge portion is chamfered and being rotatable for rotating a wafer held by the chuck means around the axis of the wafer, and a polishing member for specular machining of the chamfered edge portion of the wafer held on the chuck table, said polishing member comprising at least one ring having a polishing surface formed on its outer peripheral surface, said ring being rotatable around an axis perpendicular to the axis of the wafer and being movable into and out of polishing contact with the chamfered edge portion of the wafer.
IPC 1-7
IPC 8 full level
B24B 9/00 (2006.01); B24B 9/06 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP US)
B24B 9/065 (2013.01 - EP US)
Citation (search report)
- [A] FR 2558094 A1 19850719 - LECLERC SERGE [FR]
- [A] PATENT ABSTRACTS OF JAPAN vol. 9, no. 87 (M-372)(1810) 17 April 1985, & JP-A-59 214554 (DAIICHI SEIKI K.K.) 4 December 1984,
- [A] PATENT ABSTRACTS OF JAPAN vol. 10, no. 65 (E-388)(2122) 14 March 1986, & JP-A-60 217624 (TOSHIBA K.K.) 31 October 1985,
Designated contracting state (EPC)
DE GB IT NL
DOCDB simple family (publication)
EP 0308134 A2 19890322; EP 0308134 A3 19901024; JP H0637025 B2 19940518; JP S6471657 A 19890316; US 5097630 A 19920324
DOCDB simple family (application)
EP 88308296 A 19880908; JP 23039987 A 19870914; US 24397988 A 19880913