EP 0317092 A1 19890524 - Catalyst for electroless plating process.
Title (en)
Catalyst for electroless plating process.
Title (de)
Katalysator für die stromlose Plattierung.
Title (fr)
Catalyseur pour dépÔt chimique.
Publication
Application
Priority
GB 8725148 A 19871027
Abstract (en)
Complexes comprising X palladium atoms and Y nitrogen-containing ligands wherein X/Y>=1 are useful as sensitisers in rendering substrates catalytic to the deposition of electroless metal. The compounds can be prepared by reacting A moles of a nitrogen-containing compound with B moles of palladium where A/B<=4 at a pH of 6 or above.
IPC 1-7
IPC 8 full level
C23C 18/28 (2006.01); C23C 18/30 (2006.01); C23C 18/38 (2006.01)
CPC (source: EP)
C23C 18/28 (2013.01)
Citation (search report)
- [XD] EP 0167326 A2 19860108 - HITACHI CHEMICAL CO LTD [JP]
- [X] FR 2132172 A1 19721117 - SCHERING AG
- [A] FR 1481700 A 19670519 - PHOTOCIRCUITS CORP
- [X] PATENT ABSTRACTS OF JAPAN, vol. 9, no. 166 (C-290)[1889], 11th July 1985; & JP-A-60 36 672 (HITACHI KASEI KOGYO K.K.) 25-02-1985
- [X] METALLOBERFLÄCHE, vol. 31, no. 11, 1977, page 521; J. ANSCHÜTZ: "Aktivierung von elektrischen Nichtleitern mit palladiumhaltigen Katalysator-Lösungen"
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 0317092 A1 19890524; GB 8725148 D0 19871202; JP H01149971 A 19890613
DOCDB simple family (application)
EP 88310037 A 19881026; GB 8725148 A 19871027; JP 27191988 A 19881027