Global Patent Index - EP 0341872 A3

EP 0341872 A3 19900808 - HIGH DENSITY CONNECTORS

Title (en)

HIGH DENSITY CONNECTORS

Publication

EP 0341872 A3 19900808 (EN)

Application

EP 89304292 A 19890428

Priority

US 19163688 A 19880509

Abstract (en)

[origin: EP0341872A2] Disclosed are electrical connectors (15) for high density, large area interfaces such as in circuit pack (11) to backplane (12) interconnections. The connectors utilize some means, such as a multilayer structure (40) or flexible circuit (33), to provide electrical connection and 90 degree translation from the circuit pack surface, and a conductive elastomer (18, 19) to provide the connection from such means to the circuit pack and/or backplane surface.

IPC 1-7

H01R 23/68

IPC 8 full level

H01R 11/01 (2006.01); H01R 12/70 (2011.01); H01R 4/04 (2006.01); H01R 12/71 (2011.01); H01R 13/24 (2006.01)

CPC (source: EP)

H01R 12/7082 (2013.01); H01R 4/04 (2013.01); H01R 12/714 (2013.01); H01R 13/2414 (2013.01)

Citation (search report)

  • [A] EP 0254598 A2 19880127 - DIGITAL EQUIPMENT CORP [US]
  • [A] EP 0070136 A1 19830119 - HONEYWELL INF SYSTEMS [US]
  • [A] DE 3530827 A1 19870305 - VDO SCHINDLING [DE]
  • [YD] ELECTRO 84, PROFESSIONAL PROGRAM SESSION, RECORD #3, May 1984, LOS ANGELES US pages 1 - 11; A.T. MURPHY: "HIGH DENSITY IMPEDANCE CONTROLLED CONNECTORS"
  • [Y] IBM TECHNICAL DISCLOSURE BULLETIN. vol. 20, no. 8, January 1978, NEW YORK US page 2934 L.W. HOLMSTROM: "ELECTRICAL FIXTURE FOR PRINTED-CIRCUIT ASSEMBLIES"

Designated contracting state (EPC)

DE FR GB IT NL

DOCDB simple family (publication)

EP 0341872 A2 19891115; EP 0341872 A3 19900808; JP H0218881 A 19900123

DOCDB simple family (application)

EP 89304292 A 19890428; JP 11435889 A 19890509