Global Patent Index - EP 0346482 A4

EP 0346482 A4 19901128 - THERMOPLASTIC RESIN COMPOSITION

Title (en)

THERMOPLASTIC RESIN COMPOSITION

Publication

EP 0346482 A4 19901128 (EN)

Application

EP 88910110 A 19881118

Priority

JP 29450087 A 19871121

Abstract (en)

[origin: EP0346482A1] A thermoplastic resin composition contains a thermoplastic resin (such as polyvinyl chloride, a copolymer contq. vinyl chloride, a polyamide or polyolefin) toqether with one or more esters of formula (I): where R1 and R2 are (a) 3-22C alkyl or (b) a double bond contq., open-chain aliphatic hydrocarbon group opt. substd. by one or more epoxy or hydroxy qroups; provided that at least one of R1 and R2 is (a) or is (b) containing at least one epoxy qroup; R3 and R4 are H or Me, but are not both Me. Pref. R1 and R2 are 3-22C alkyl or alkenyl (opt. contg. 1-3 epoxy groups) or monohydroxyalk(en)yl; most pref. R1 and R2 are 6-22C alk(en)yl contg. 1-3 (esp. 1-2) epoxy qroups. The proportion of ester per 100 pts. thermoplastic resin is 1-100 pts. (pref. 3-50 pts.) for vinyl chloride polymer or copolymer; 1-20 pts. (pref. 3-10 pts.) for polyamide; 1-10 pts. for polyolefin. Compositions where the ester is one of the following esters of 4,5-epoxy hexahydrophthalic acid: bis(3,4-epoxyhexyl), bis(10,11-epoxy undecyl), bis(9,10-epoxy octadecyl), bis(9,10:12.13- diepoxyoctadecyl), bis(7,8-epoxy-2-octenyl)) or (9,10-epoxyoctadecyl) (9,10:12,13-diepoxyoctadecyl).

IPC 1-7

C08L 101/00; C08K 5/15

IPC 8 full level

C08K 5/12 (2006.01); C08K 5/10 (2006.01); C08K 5/1515 (2006.01); C08L 27/00 (2006.01); C08L 101/00 (2006.01)

CPC (source: EP)

C08K 5/1515 (2013.01)

Citation (search report)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 0346482 A1 19891220; EP 0346482 A4 19901128; JP H01135869 A 19890529; JP H0725928 B2 19950322; WO 8904855 A1 19890601

DOCDB simple family (application)

EP 88910110 A 19881118; JP 29450087 A 19871121; JP 8801167 W 19881118