EP 0349519 B1 19910424 - METHOD AND DEVICE FOR FILLING HOLLOW SPACES FRAMES
Title (en)
METHOD AND DEVICE FOR FILLING HOLLOW SPACES FRAMES
Publication
Application
Priority
AT 170688 A 19880630
Abstract (en)
[origin: US4947537A] When filling hollow molds, to be bent into spacer frames, with a hygroscopic material, the filling process is interrupted as soon as the material filled into the hollow molding has reached a location of the hollow molding where the latter is to be bent into a corner. At this location, the wall of the hollow molding which subsequently forms the inside in the spacer frame is made to bulge. Then introduction of hygroscopic material into the hollow molding is continued, interrupted at the next location of a corner, the walls are made to bulge, until four locations of the sidewall in the hollow molding have been provided with a bulge, and the hollow molding is completely filled. Also, a device is described suitable for performing the process. This device comprises a stamp (16) for indenting the hollow molding and an ultrasonic sensor which responds to the filling level of the hygroscopic material in the hollow molding.
IPC 1-7
IPC 8 full level
E06B 3/673 (2006.01)
CPC (source: EP US)
E06B 3/67317 (2013.01 - EP US); Y10T 29/49627 (2015.01 - EP US); Y10T 29/4998 (2015.01 - EP US); Y10T 29/49986 (2015.01 - EP US); Y10T 29/5199 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE CH DE ES FR GB GR IT LI LU NL SE
DOCDB simple family (publication)
US 4947537 A 19900814; AT 391861 B 19901210; AT A170688 A 19900615; AT E62974 T1 19910515; DE 3914212 A1 19900104; DE 3914212 C2 19951123; DE 58900095 D1 19910529; DE 8905432 U1 19890824; EP 0349519 A1 19900103; EP 0349519 B1 19910424
DOCDB simple family (application)
US 37325589 A 19890629; AT 170688 A 19880630; AT 89890118 T 19890424; DE 3914212 A 19890428; DE 58900095 T 19890424; DE 8905432 U 19890428; EP 89890118 A 19890424