Global Patent Index - EP 0353243 A4

EP 0353243 A4 19920429 - IMPROVED DENSITY SEMICUSTOM INTEGRATED CIRCUIT CHIP

Title (en)

IMPROVED DENSITY SEMICUSTOM INTEGRATED CIRCUIT CHIP

Publication

EP 0353243 A4 19920429 (EN)

Application

EP 88903542 A 19880314

Priority

US 3235387 A 19870331

Abstract (en)

[origin: WO8807763A1] A logic cell, for use in a semicustom chip, which is comprised of a plurality of transistors that are integrated into a semiconductor substrate and are interconnected within the cell to perform a logic function. This cell has sidewalls (21, 22, 23, 24) which define the space in the chip which contains all the transistors and their interconnections within the cell; at least one of the sidewalls (e.g., 22 and 24) is shaped to include a step which gives the cell a narrow top and a wide bottom; and one or more of the cell's transistors lies below the step in the wide bottom of the cell. Many of these cells are arranged in spaced apart rows (R1 and R2) on the semicustom chip in which the narrow tops of the cell line up. Conductors (11) which interconnect the cells are disposed in the space (CH2) between the narrow tops of the cells and over the transistors in the wide bottoms of the cells. Using this architecture, the density with which a logic cell is integrated to a semicustom chip is improved more than 100 %.

IPC 1-7

H01L 27/10; H01L 27/15; H01L 27/02

IPC 8 full level

H01L 21/822 (2006.01); H01L 21/82 (2006.01); H01L 23/52 (2006.01); H01L 27/04 (2006.01); H01L 27/118 (2006.01)

CPC (source: EP US)

H01L 23/52 (2013.01 - EP US); H01L 27/11801 (2013.01 - EP US); H01L 27/11807 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)

Citation (search report)

  • [A] PATENT ABSTRACTS OF JAPAN vol. 7, no. 288 (E-218)(1433) 22 December 1983 & JP-A-58 164 243 ( TOKYO SHIBAURA DENKI K.K. ) 29 September 1983
  • See references of WO 8807763A1

Designated contracting state (EPC)

BE DE FR GB NL

DOCDB simple family (publication)

WO 8807763 A1 19881006; EP 0353243 A1 19900207; EP 0353243 A4 19920429; JP H02501876 A 19900621; US 4949149 A 19900814

DOCDB simple family (application)

US 8800789 W 19880314; EP 88903542 A 19880314; JP 50318288 A 19880314; US 3235387 A 19870331