EP 0361305 B1 19940119 - Injection molding die apparatus for use in the production of substrate of optical disk.
Title (en)
Injection molding die apparatus for use in the production of substrate of optical disk.
Title (de)
Formspritzvorrichtung für die Herstellung eines Substrats einer optischen Platte.
Title (fr)
Appareil de moulage par injection pour la fabrication de substrat de disque optique.
Publication
Application
Priority
JP 24861688 A 19880930
Abstract (en)
[origin: EP0361305A2] An injection molding die apparatus for use in the production of an optical disk substrate (19) has a stationary die part (11) having a mirror-finished surface (12), a movable die part (13) carrying a stamper (14), an outer peripheral ring (16) slidably fitting on the outer periphery of the movable die part (13) and contactable with the stationary die part (11) when the movable die part (13) has been moved close to the stationary die part (11), such that a die cavity (17) to be charged with injected molten plastic is formed by the mirror surface (12) of the stationary die part (11), the stamper (14) and the outer peripheral ring (16). First and second ejection mechanisms (20, 27) are provided to push the injection-molded optical disk substrate (19) away from the stamper (14) simultaneously both at the central portion and outer peripheral portion of the optical disk substrate (19), while the optical disk substrate (19) is held in close contact with the mirror-finished surface (12) of the stationary die part (11), whereby the separation of the injection-molded optical disk substrate (19) from the stamper (14) takes place uniformly without distortion and failure in the transfer of the track grooves.
IPC 1-7
IPC 8 full level
B29C 45/26 (2006.01); B29C 45/40 (2006.01); G11B 7/26 (2006.01); B29L 17/00 (2006.01)
CPC (source: EP KR US)
B29C 45/10 (2013.01 - KR); B29C 45/263 (2013.01 - EP US); B29C 45/40 (2013.01 - EP US); G11B 7/26 (2013.01 - EP US); B29C 2045/2648 (2013.01 - EP US); B29C 2045/2657 (2013.01 - EP US); Y10S 425/81 (2013.01 - EP US)
Designated contracting state (EPC)
AT CH DE FR GB LI NL
DOCDB simple family (publication)
EP 0361305 A2 19900404; EP 0361305 A3 19910130; EP 0361305 B1 19940119; AT E100621 T1 19940215; CA 1321690 C 19930831; DE 68912480 D1 19940303; DE 68912480 T2 19940526; JP 2636903 B2 19970806; JP H0295819 A 19900406; KR 0136374 B1 19980425; KR 900004476 A 19900412; US 5018962 A 19910528
DOCDB simple family (application)
EP 89117408 A 19890920; AT 89117408 T 19890920; CA 612040 A 19890920; DE 68912480 T 19890920; JP 24861688 A 19880930; KR 890014140 A 19890930; US 40989889 A 19890920