EP 0364095 A3 19901107 - POST-TERMINATION PROCESS FOR THICK-FILM RESISTORS OF PRINTED-CIRCUIT BOARDS
Title (en)
POST-TERMINATION PROCESS FOR THICK-FILM RESISTORS OF PRINTED-CIRCUIT BOARDS
Publication
Application
Priority
US 25601788 A 19881011
Abstract (en)
[origin: EP0364095A2] A printed circuit board (10) includes both high and low resistive value thick film resistors interconnected by a copper film (18). To lower the contact resistance to the thick film resistors (12) of high value, each is provided at its ends with a termination (16A,16B) of a composition similar to that used for the low value resistors (16). This provides a relatively low-resistance contact region which overcomes the difficulty that a copper thick film conductor has in making electrical connections to compositions generally used for making high value thick film resistors. The compositions of high and low resistivities are adapted to permit firing of both compositions in a single firing step.
IPC 1-7
IPC 8 full level
H01C 1/142 (2006.01); H01C 7/00 (2006.01); H01C 17/06 (2006.01); H01C 17/28 (2006.01); H05K 1/16 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01)
CPC (source: EP KR US)
H01C 1/142 (2013.01 - EP US); H01C 7/003 (2013.01 - EP US); H01C 17/281 (2013.01 - EP US); H05K 1/16 (2013.01 - KR); H05K 1/167 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US); H05K 1/092 (2013.01 - EP US); H05K 2201/035 (2013.01 - EP US); H05K 2201/0391 (2013.01 - EP US); H05K 2203/1453 (2013.01 - EP US); H05K 2203/1461 (2013.01 - EP US)
Citation (search report)
- [Y] DE 3741200 A1 19880609 - TOSHIBA KAWASAKI KK [JP]
- [A] US 4751492 A 19880614 - TSUZUKI TAKAYOSHI [JP], et al
- [A] US 3914514 A 19751021 - MACKENZIE GEORGE D, et al
- [X] PATENT ABSTRACTS OF JAPAN vol. 8, no. 190 (E-263)(1627) 31 August 1984, & JP-A-59 79563 (SANYO DENKI K.K.) 8 May 1984,
- [Y] SOLID STATE TECHNOLOGY. vol. 24, no. 1, January 1981, WASHINGTON US pages 73 - 79; STEIN ET. AL:: "Basic metal thick film conductors"
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0364095 A2 19900418; EP 0364095 A3 19901107; JP H02181993 A 19900716; JP H0724331 B2 19950315; KR 900007287 A 19900509; KR 920005985 B1 19920725; US 5164698 A 19921117; US 5169679 A 19921208
DOCDB simple family (application)
EP 89308931 A 19890904; JP 26377489 A 19891009; KR 890014516 A 19891010; US 25601788 A 19881011; US 72401191 A 19910701