EP 0368231 A2 19900516 - Process of producing copper plated resin article.
Title (en)
Process of producing copper plated resin article.
Title (de)
Verfahren zur Herstellung von mit Kupfer plattierten Kunststoffartikeln.
Title (fr)
Procédé de fabrication d'un article revêtu de cuivre.
Publication
Application
Priority
- JP 5209589 A 19890306
- JP 12293689 A 19890518
- JP 12293889 A 19890518
- JP 27939488 A 19881107
Abstract (en)
A process of producing a copper-plated resin article by forming a copper layer strongly adhered to the resin article by a dry process, which comprises heating a resin article having a heat deformation temperature higher than 165 DEG C and copper formate under a reduced pressure or in a non-oxidative atmosphere in such a manner that the resin article is heated to a predetermined temperature in the range of at least 165 DEG and lower than the heat deformation temperature of the resin article and the copper formate is temperature-raised at a rate of at least 1 DEG C/min in the temperature range of at least from 130 DEG C to 165 DEG C and kept at a temperature of at least 165 DEG C.
IPC 1-7
IPC 8 full level
C23C 18/08 (2006.01); C25D 5/56 (2006.01); H05K 3/10 (2006.01)
CPC (source: EP KR US)
C08J 7/00 (2013.01 - KR); C23C 18/08 (2013.01 - EP US); C23C 18/18 (2013.01 - KR); C25D 5/56 (2013.01 - EP US); H05K 3/105 (2013.01 - EP US); Y10S 205/927 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0368231 A2 19900516; EP 0368231 A3 19901031; EP 0368231 B1 19940615; DE 68916180 D1 19940721; DE 68916180 T2 19941117; KR 0137370 B1 19980427; KR 900007923 A 19900602; US 5106462 A 19920421
DOCDB simple family (application)
EP 89120578 A 19891107; DE 68916180 T 19891107; KR 890016012 A 19891106; US 43281189 A 19891107