EP 0368470 A1 19900516 - Methods for depositing finish coatings on substrates of anodisable metals and the products thereof.
Title (en)
Methods for depositing finish coatings on substrates of anodisable metals and the products thereof.
Title (de)
Verfahren zur Ablagerung von Deckschichten auf anodisierbaren Metall-Substraten und die erhaltenen Produkte.
Title (fr)
Procédés pour le dépÔt de couches de finition sur des substrats de métaux anodisables et les produits obtenus.
Publication
Application
Priority
CA 580280 A 19881014
Abstract (en)
The invention provides a method of depositing a layer of a finish metal on substrates of anodisable metals which comprises the steps of a) anodising the substrate at the said surface to produce a porous anodised layer of thickness from about 0.5 to about 50 micrometres and having pores therein of transverse dimension from about 0.005 to 0.10 micrometres; b) depositing a pore-filling metal into the pores using AC or modified AC deposition to completely fill the pores with the metal up to the surface of the anodized layer, and continuing the deposition of the pore-filling metal to form a continuous support layer on the surface of the anodised layer of thickness in the range about 0.5 to 3 micrometres; and c) depositing at least one coating of a finish metal on the support layer. The method is particularly useful for plating finish coatings of chromium on aluminium and its alloys.
IPC 1-7
IPC 8 full level
C25D 5/00 (2006.01); C25D 5/42 (2006.01); C25D 5/44 (2006.01); C25D 11/12 (2006.01); C25D 11/18 (2006.01)
CPC (source: EP)
C25D 5/44 (2013.01); C25D 11/12 (2013.01)
Citation (search report)
- [A] EP 0121880 A1 19841017 - HOECHST AG [DE]
- [A] EP 0178831 A1 19860423 - ALCAN INT LTD [CA]
- [AD] US 4226680 A 19801007 - COOKE WILLIAM E, et al
- [A] S. WERNICK et al.: "The Surface Treatment and Finishing of Aluminium and its Alloys", vol. 2, Fifth Edition, 1986, pages 1011-1016
Designated contracting state (EPC)
DE ES FR GB IT NL SE
DOCDB simple family (publication)
DOCDB simple family (application)
EP 89310173 A 19891004; JP 26408789 A 19891012