EP 0374956 A3 19910424 - DECAY MOLD
Title (en)
DECAY MOLD
Publication
Application
Priority
- JP 32217688 A 19881222
- JP 32217788 A 19881222
- JP 32217888 A 19881222
Abstract (en)
[origin: EP0374956A2] A decay mold comprising a powder material having a transition accompanied with a volume change occurring at a temperature lower than the sintering temperature and a binder thereof, comprising a material thermally decomposable at a temperature lower than the sintering temperature, or comprising a material soluble at least in one solvent in which the molding assistant to impart formability to the powder to be molded is insoluble. By using the mold of the invention, an arbitrary form of sintered products can be manufactured without damaging it at the demolding.
IPC 1-7
IPC 8 full level
B28B 7/34 (2006.01)
CPC (source: EP)
B28B 7/342 (2013.01)
Citation (search report)
- [X] EP 0243502 A1 19871104 - KOURANSHA KABUSHIKI KAISHA [JP]
- [X] US 4271114 A 19810602 - OHNO JOHN M
- [X] GB 2107635 A 19830505 - NORTON CO
- [X] GB 2030065 A 19800402 - NORTON CO
- [X] US 3123886 A 19640310
- [X] DE 3511694 A1 19851010 - HITACHI LTD [JP]
- [A] EP 0288236 A2 19881026 - HITACHI LTD [JP]
Designated contracting state (EPC)
DE FR GB SE
DOCDB simple family (publication)
DOCDB simple family (application)
EP 89123816 A 19891222