Global Patent Index - EP 0380593 A4

EP 0380593 A4 19900703 - HIGH PRESSURE BONDING PROCESS.

Title (en)

HIGH PRESSURE BONDING PROCESS.

Title (de)

HOCHDRUCKKLEBEVERFAHREN.

Title (fr)

PROCEDE DE SOUDAGE A HAUTE PRESSION.

Publication

EP 0380593 A4 19900703 (EN)

Application

EP 89902114 A 19890110

Priority

US 8900098 W 19890110

Abstract (en)

[origin: WO8906583A1] The invention provides a method for inserting a cylindrical body (34) into a larger body (42) by bonding. The cylindrical body (34) may contain defects (28) positioned at a predetermined location. After bonding, the combined structure may be machined to produce a body having a fault positioned at a predetermined location therein.

IPC 1-7

B23K 20/00

IPC 8 full level

B23K 20/00 (2006.01); B23K 20/02 (2006.01)

CPC (source: EP)

B23K 20/00 (2013.01); B23K 20/021 (2013.01); B23K 2101/001 (2018.07)

Citation (search report)

  • No further document
  • See references of WO 8906583A1

Designated contracting state (EPC)

DE GB LU NL SE

DOCDB simple family (publication)

WO 8906583 A1 19890727; EP 0380593 A1 19900808; EP 0380593 A4 19900703

DOCDB simple family (application)

US 8900098 W 19890110; EP 89902114 A 19890110