EP 0384679 B1 19940817 - Electrolytic deposition of gold-containing alloys.
Title (en)
Electrolytic deposition of gold-containing alloys.
Title (de)
Elektroplattierung von Gold enthaltenden Legierungen.
Title (fr)
DépÔt électrolytique d'alliages d'or.
Publication
Application
Priority
GB 8903818 A 19890220
Abstract (en)
[origin: EP0384679A1] A gold-copper alloy of good corrosion resistance is electrolytically deposited from a bath containing a cyanide compound of gold (e.g. KAu(CN)2), a cyanide compound of copper and tellurium or bismuth in the form of a soluble salt (e.g. sodium tellurite), the bath being substantially free of any other metal in an electrolytically depositable form. The bath generally also contains a cyanide salt (e.g. KCN) and may also contain a surface-active agent. Foreign metals, e.g. zinc, may be chelated or complexed to prevent deposition thereof.
IPC 1-7
IPC 8 full level
C25D 3/62 (2006.01)
CPC (source: EP)
C25D 3/62 (2013.01)
Designated contracting state (EPC)
AT BE CH DE DK ES FR GB GR IT LI LU NL SE
DOCDB simple family (publication)
EP 0384679 A1 19900829; EP 0384679 B1 19940817; AT E110124 T1 19940915; DE 69011549 D1 19940922; DE 69011549 T2 19950406; GB 8903818 D0 19890405
DOCDB simple family (application)
EP 90301749 A 19900219; AT 90301749 T 19900219; DE 69011549 T 19900219; GB 8903818 A 19890220