EP 0388473 A4 19920304 - SILICONE-EPOXY RESIN COMPOSITION AND CONDUCTIVE ADHESIVE PREPARED THEREFROM
Title (en)
SILICONE-EPOXY RESIN COMPOSITION AND CONDUCTIVE ADHESIVE PREPARED THEREFROM
Publication
Application
Priority
- JP 22155588 A 19880902
- JP 30652288 A 19881202
Abstract (en)
[origin: WO9002768A1] A silicone-epoxy resin composition of this invention comprises a silicone-epoxy resin of general formula (I) and a curing agent. It has an excellent compatibility with an epoxy resin or curing agent and a high curing rate and, when cured, offers well-balanced flexibility, humidity resistance and heat resistance. Hence, it is effective for the bonding and sealing of electric or electronic components requiring a low stress. For example, a conductive adhesive prepared by adding a conductive filler to this composition can exhibit an excellent performance in the bonding of large-sized ICs or LSIs or in assembling quartz oscillators.
IPC 1-7
IPC 8 full level
C08G 59/30 (2006.01); C09J 163/00 (2006.01); H01B 1/22 (2006.01); H01B 1/24 (2006.01)
CPC (source: EP)
C08G 59/306 (2013.01); C09J 163/00 (2013.01); H01B 1/22 (2013.01); H01B 1/24 (2013.01); C08L 2666/54 (2013.01)
Citation (search report)
- [X] BE 742710 A 19700605
- [X] DE 1251034 B
- [XP] EP 0319472 A2 19890607 - CIBA GEIGY AG [CH]
- [A] WORLD PATENTS INDEX LATEST Derwent Publications Ltd., London, GB; AN 85-015747 & JP-A-59 212 250 (MITSUBISHI ELECTRIC) 1 February 1984
- See references of WO 9002768A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 9002768 A1 19900322; EP 0388473 A1 19900926; EP 0388473 A4 19920304
DOCDB simple family (application)
JP 8900905 W 19890901; EP 89909855 A 19890901