EP 0401513 A2 19901212 - Thin film bonding method and apparatus having structure for removing wetting agents.
Title (en)
Thin film bonding method and apparatus having structure for removing wetting agents.
Title (de)
Verfahren und Apparat zum Aufbringen eines dünnen Films mit einer Einrichtung zum Entfernen von Netzmitteln.
Title (fr)
Procédé et appareil pour faire adhérer un film mince comportant un dispositif pour l'élimination d'agents mouillants.
Publication
Application
Priority
JP 14196889 A 19890604
Abstract (en)
A thin film bonding method and apparatus having structure for removing wetting agents applied to a thin film and base plate that are to be bonded by pressure and heat. A spray or rollers (30) apply the wetting agent prior to the initial bonding of a leading edge of the thin film to a leading edge of the base plate. A pressure roller (15) applies heat and pressure to the film and base plate, bonding them together as the roller rotates and drives the plate toward a cleaning position. Suction and agent removal rollers (80) are used to remove the residual excess agent from the bonded film and the pressure roller. The removal rollers are joined together by a link mechanism that has a spring bias and is operation by a gear mechanism that provides a wiping action.
IPC 1-7
IPC 8 full level
B32B 43/00 (2006.01); B29C 63/02 (2006.01); B29C 65/20 (2006.01); B29C 65/78 (2006.01); B32B 37/16 (2006.01); B32B 37/22 (2006.01); G03F 7/16 (2006.01); H05K 3/06 (2006.01); B29L 9/00 (2006.01); B29L 31/34 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP US)
B32B 37/0038 (2013.01 - EP US); B32B 37/226 (2013.01 - EP US); G03F 7/161 (2013.01 - EP US); B29L 2031/3425 (2013.01 - EP US); H05K 3/0079 (2013.01 - EP US); Y10T 156/1111 (2015.01 - EP US); Y10T 156/1928 (2015.01 - EP US)
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 0401513 A2 19901212; EP 0401513 A3 19911121; EP 0401513 B1 19980121; CA 2015516 A1 19901204; DE 69031964 D1 19980226; DE 69031964 T2 19980813; JP H037344 A 19910114; JP H0651360 B2 19940706; SG 43247 A1 19971017; US 5125999 A 19920630
DOCDB simple family (application)
EP 90108470 A 19900504; CA 2015516 A 19900426; DE 69031964 T 19900504; JP 14196889 A 19890604; SG 1996006411 A 19900504; US 51405690 A 19900424