EP 0407985 B1 19980107 - Method for preventing cross contamination during semiconductor wafer processing and shield assembly used in this method
Title (en)
Method for preventing cross contamination during semiconductor wafer processing and shield assembly used in this method
Title (de)
Verfahren zum Verhindern der gegenseitigen Verunreinigung während der Bearbeitung von Halbleiterplättchen und in diesem Verfahren verwendete Abschirmvorrichtung
Title (fr)
Méthode permettant d'empêcher la contamination croisée pendant le traitement de plaquettes semi-conductrices et assemblage d'écran utilisé dans cette méthode
Publication
Application
Priority
US 37769289 A 19890710
Abstract (en)
[origin: EP0407985A1] A method for preventing cross-contamination of semiconductor wafers during processing comprising covering a surface portion of a support assembly with a process compatible material, engaging a semiconductor wafer with the support assembly, processing the wafer swhile it is engaged with the support member, and removing the process compatible material from the support assembly after said material is considered to be contaminated. A shield particularly adapted for this process includes a shield portion (18) made from a process compatible material and a process-compatible adhesive for attaching the shield portion to the support assembly (10).
IPC 1-7
H01L 21/00; C23C 14/50; H01L 21/265; H01L 21/302; H01L 21/312
IPC 8 full level
H01J 37/20 (2006.01); H01J 37/317 (2006.01); H01L 21/265 (2006.01); H01L 21/266 (2006.01); H01L 21/302 (2006.01)
CPC (source: EP US)
H01L 21/265 (2013.01 - EP US); H01L 21/302 (2013.01 - EP US); Y10S 148/083 (2013.01 - EP US); Y10S 438/905 (2013.01 - EP US); Y10S 438/908 (2013.01 - EP US)
Designated contracting state (EPC)
BE CH DE FR GB LI NL
DOCDB simple family (publication)
US 4937206 A 19900626; DE 69031886 D1 19980212; DE 69031886 T2 19980813; EP 0407985 A1 19910116; EP 0407985 B1 19980107; JP 2945091 B2 19990906; JP H0346741 A 19910228; US 5476520 A 19951219
DOCDB simple family (application)
US 37769289 A 19890710; DE 69031886 T 19900710; EP 90113176 A 19900710; JP 18255390 A 19900710; US 79974891 A 19911122