EP 0411423 B1 19980218 - Curable articles prepared using curable dielectric polyphenylene ether-polyepoxide compositions.
Title (en)
Curable articles prepared using curable dielectric polyphenylene ether-polyepoxide compositions.
Title (de)
Härtbare Gegenstände, die aus härtbaren dielektrischen Polyphenyläther-Polyepoxid-Zusammensetzungen hergestellt sind.
Title (fr)
Articles durcissables fabriqués avec des compositions diélectriques durcissables de poly(éther de phénylène)-polyépoxyde
Publication
Application
Priority
US 38921589 A 19890803
Abstract (en)
[origin: EP0411423A2] Curable polyphenylene ether-polyepoxide compositions containing 1-methylimidazole as the primary curing catalyst have improved latency properties and are useful in the preparation of laminates and bonding sheets for printed circuit boards.
IPC 1-7
C08L 63/00; C08L 71/12; C08G 59/40; C08G 59/50; C08L 63/04; C08K 5/09; C08K 3/20
IPC 8 full level
C08G 59/00 (2006.01); C08G 59/40 (2006.01); C08G 59/50 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01); C08L 71/12 (2006.01); H01B 3/42 (2006.01); H05K 1/03 (2006.01); C08L 83/04 (2006.01)
CPC (source: EP US)
C08G 59/40 (2013.01 - EP US); C08G 59/686 (2013.01 - EP US); C08L 63/00 (2013.01 - EP US); C08L 71/123 (2013.01 - EP US); C08L 83/04 (2013.01 - EP US); H05K 1/0326 (2013.01 - EP US); Y10S 428/901 (2013.01 - EP US); Y10S 428/913 (2013.01 - EP US); Y10T 428/24802 (2015.01 - EP US); Y10T 428/2949 (2015.01 - EP US); Y10T 428/31511 (2015.04 - EP US); Y10T 428/31518 (2015.04 - EP US); Y10T 428/31522 (2015.04 - EP US); Y10T 428/31627 (2015.04 - EP US); Y10T 428/31678 (2015.04 - EP US); Y10T 428/31688 (2015.04 - EP US)
C-Set (source: EP US)
Citation (examination)
- Translation of JP-A-1024825
- Translation of JP-A-5869052
- J.Appl.Polym.Sci.,vol.30,1985, pages 531-546
Designated contracting state (EPC)
DE ES FR GB IT NL
DOCDB simple family (publication)
EP 0411423 A2 19910206; EP 0411423 A3 19910703; EP 0411423 B1 19980218; DE 69032052 D1 19980326; DE 69032052 T2 19980924; ES 2112246 T3 19980401; JP H03115426 A 19910516; JP H0617457 B2 19940309; US 5089343 A 19920218
DOCDB simple family (application)
EP 90114048 A 19900723; DE 69032052 T 19900723; ES 90114048 T 19900723; JP 20534090 A 19900803; US 38921589 A 19890803