Global Patent Index - EP 0418993 B1

EP 0418993 B1 19960117 - Continuous molded electronic component assembly

Title (en)

Continuous molded electronic component assembly

Title (de)

Anordnung von kontinuierlich eingebetteten elektronischen Bauelementen

Title (fr)

Assemblage de composants électroniques moulés de façon continue

Publication

EP 0418993 B1 19960117 (EN)

Application

EP 90302433 A 19900307

Priority

US 40952489 A 19890919

Abstract (en)

[origin: EP0418993A2] A continuous molded electronic component assembly process in which a continuous line of components (17) are supplied on reels (20,21) for assembly and insertion is described. The supply reels (20) of electronic components are made by an injection molding process, reeled and supplied to assembly and insertion machines. The assembly and insertion machines provide the means for removing, assembling and inserting the electronic components. Examples of the process, but not limited to, are shunts, wire end terminals and pilot posts.

IPC 1-7

H01R 43/24; H01R 43/20; H01R 23/72; H05K 13/04

IPC 8 full level

B23P 21/00 (2006.01); B65G 11/00 (2006.01); B65H 54/00 (2006.01); H01R 13/11 (2006.01); H01R 43/20 (2006.01); H01R 43/24 (2006.01)

CPC (source: EP)

H01R 43/24 (2013.01)

Designated contracting state (EPC)

AT BE CH DE DK ES FR GB GR IT LI LU NL SE

DOCDB simple family (publication)

EP 0418993 A2 19910327; EP 0418993 A3 19930224; EP 0418993 B1 19960117; AT E133297 T1 19960215; DE 69024891 D1 19960229; DE 69024891 T2 19960725; HK 72696 A 19960503; JP 2777836 B2 19980723; JP H03108291 A 19910508

DOCDB simple family (application)

EP 90302433 A 19900307; AT 90302433 T 19900307; DE 69024891 T 19900307; HK 72696 A 19960425; JP 9523290 A 19900412