EP 0418993 B1 19960117 - Continuous molded electronic component assembly
Title (en)
Continuous molded electronic component assembly
Title (de)
Anordnung von kontinuierlich eingebetteten elektronischen Bauelementen
Title (fr)
Assemblage de composants électroniques moulés de façon continue
Publication
Application
Priority
US 40952489 A 19890919
Abstract (en)
[origin: EP0418993A2] A continuous molded electronic component assembly process in which a continuous line of components (17) are supplied on reels (20,21) for assembly and insertion is described. The supply reels (20) of electronic components are made by an injection molding process, reeled and supplied to assembly and insertion machines. The assembly and insertion machines provide the means for removing, assembling and inserting the electronic components. Examples of the process, but not limited to, are shunts, wire end terminals and pilot posts.
IPC 1-7
IPC 8 full level
B23P 21/00 (2006.01); B65G 11/00 (2006.01); B65H 54/00 (2006.01); H01R 13/11 (2006.01); H01R 43/20 (2006.01); H01R 43/24 (2006.01)
CPC (source: EP)
H01R 43/24 (2013.01)
Designated contracting state (EPC)
AT BE CH DE DK ES FR GB GR IT LI LU NL SE
DOCDB simple family (publication)
EP 0418993 A2 19910327; EP 0418993 A3 19930224; EP 0418993 B1 19960117; AT E133297 T1 19960215; DE 69024891 D1 19960229; DE 69024891 T2 19960725; HK 72696 A 19960503; JP 2777836 B2 19980723; JP H03108291 A 19910508
DOCDB simple family (application)
EP 90302433 A 19900307; AT 90302433 T 19900307; DE 69024891 T 19900307; HK 72696 A 19960425; JP 9523290 A 19900412