EP 0421579 A3 19911023 - PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DIE PACKAGES AND METHOD OF MAKING SAME
Title (en)
PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DIE PACKAGES AND METHOD OF MAKING SAME
Publication
Application
Priority
US 41584489 A 19891002
Abstract (en)
[origin: EP0421579A2] A plastic encapsulated integrated circuit package is disclosed which comprises a multilayer ground plane assembly bonded to a lead frame with an integrated circuit die bonded to the composite assembly. The multilayer ground plane assembly is first formed by bonding together a copper sheet and a thermally conductive polyimide material insulating layer to which is also bonded a layer of a b-stage epoxy resin. The ground plane assembly is then bonded to the lead frame by placing the b-stage epoxy layer of the ground plane assembly against the lead frame and heating the ground plane assembly and lead frame to a temperature of from about 120 DEG C to just under 200 DEG C for a time period not exceeding about 10 seconds to bond the b-stage epoxy resin to the lead frame without oxidizing it. An integrated circuit die is then attached to the composite assembly with an epoxy adhesive and the die attached assembly is then cured in a non-oxidizing atmosphere in an oven at approximately 150 DEG C for about 90 minutes to cure the adhesive and the b-stage epoxy layer. The die is then electrically connected to the lead frame. The bonded together ground plane/lead frame/die composite assembly is then placed in a mold and encapsulated in plastic.
IPC 1-7
IPC 8 full level
H01L 23/14 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01)
CPC (source: EP US)
H01L 21/4882 (2013.01 - EP US); H01L 23/315 (2013.01 - EP US); H01L 23/4334 (2013.01 - EP US); H01L 23/49527 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/2612 (2013.01 - EP); H01L 2224/45144 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01018 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/30107 (2013.01 - EP US); H01L 2924/3011 (2013.01 - EP US)
C-Set (source: EP US)
Citation (search report)
- [Y] US 4783428 A 19881108 - KALFUS MARTIN A [US]
- [A] EP 0064854 A1 19821117 - ITT [US], et al
- [X] PROCEEDINGS OF THE IEEE/CHMT 1989 ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM,1989 New York ,US pages 221 - 229; D.Mallik et al.: "Multi-layer molded plastic package"
- [Y] RESEARCH DISCLOSURE. no. 273, January 1987, New York , NY , US page 32 "Modified polyimide for Low End Packaging"
- [A] PATENT ABSTRACTS OF JAPAN vol. 10, no. 95 (E-395)(2152) 12 April 1986, & JP-A-60 236236 (HITACHI DENSEN) 25 November 1985,
- [A] PATENT ABSTRACTS OF JAPAN vol. 12, no. 80 (E-590)(2927) 12 March 1988, & JP-A-62 219546 (TOSHIBA CORP) 26 September 1987,
Designated contracting state (EPC)
AT BE CH DE DK ES FR GB GR IT LI LU NL SE
DOCDB simple family (publication)
EP 0421579 A2 19910410; EP 0421579 A3 19911023; EP 0421579 B1 19951018; AT E129362 T1 19951115; DE 69023091 D1 19951123; DE 69023091 T2 19960515; JP 2704213 B2 19980126; JP H03126233 A 19910529; US 5068708 A 19911126
DOCDB simple family (application)
EP 90308089 A 19900724; AT 90308089 T 19900724; DE 69023091 T 19900724; JP 21799590 A 19900817; US 41584489 A 19891002