Global Patent Index - EP 0432637 B1

EP 0432637 B1 19931027 - Device for dressing the cutting edge of a cutting-off tool for severing slices from an ingot or block-like workpiece, especially semiconductor material, use and sewing method for the same.

Title (en)

Device for dressing the cutting edge of a cutting-off tool for severing slices from an ingot or block-like workpiece, especially semiconductor material, use and sewing method for the same.

Title (de)

Vorrichtung zum Nachschärfen der Schneidkante von Trennwerkzeugen beim Abtrennen von Scheiben von stab- oder blockförmigen Werkstücken, insbesondere aus Halbleitermaterial, ihre Verwendung und Sägeverfahren.

Title (fr)

Dispositif pour dresser le tranchant d'un outil de tronçonnage lors du tronçonnage de tranches d'un barreau ou d'une pièce en bloc, en particulier d'un matériau semi-conducteur, son application et procédé de sciage.

Publication

EP 0432637 B1 19931027 (DE)

Application

EP 90123400 A 19901206

Priority

DE 3941038 A 19891212

Abstract (en)

[origin: EP0432637A1] The device indicated can be used particularly in the sawing of internal holes in semiconductor bars. It contains a dressing system which consists of at least one elongated dressing stone whose end face faces the cutting edge, can be moved laterally relative to the saw blade and, at the end, has two mutually opposite working faces which, during dressing, can be brought into contact laterally with that surface of the cutting edge which faces them. The device is distinguished by a low susceptibility to malfunctioning and permits dressing operations during the sawing operations.

IPC 1-7

B24B 53/00; B28D 5/02

IPC 8 full level

B24B 53/00 (2006.01); B24D 99/00 (2010.01); B28D 5/00 (2006.01); B28D 5/02 (2006.01); H01L 21/304 (2006.01)

CPC (source: EP US)

B24B 53/00 (2013.01 - EP US); B28D 5/028 (2013.01 - EP US)

Designated contracting state (EPC)

DE GB IT

DOCDB simple family (publication)

EP 0432637 A1 19910619; EP 0432637 B1 19931027; DE 3941038 A1 19910613; DE 59003241 D1 19931202; JP H03184767 A 19910812; JP H0725027 B2 19950322; US 5144938 A 19920908

DOCDB simple family (application)

EP 90123400 A 19901206; DE 3941038 A 19891212; DE 59003241 T 19901206; JP 27791690 A 19901018; US 61678390 A 19901120