Global Patent Index - EP 0433575 B2

EP 0433575 B2 19991006 - Device for applying marks with embossing foils

Title (en)

Device for applying marks with embossing foils

Title (de)

Vorrichtung zum Aufkleben von Marken aus einer Prägefolie

Title (fr)

Dispositif pour appliquer des marques à partir d'une bande à estamper

Publication

EP 0433575 B2 19991006 (DE)

Application

EP 90118271 A 19900924

Priority

  • CH 133290 A 19900419
  • CH 457189 A 19891221

Abstract (en)

[origin: EP0433575A1] The adhesive applying of marks (3; 3') from a foil in tape form to predetermined points on a substrate (1) which is printed with motifs (2) and is drawn at a predetermined rate of advancement through at least one adhesion station is performed by means of punches of the adhesion station raised radially above a punching cylinder. The punches have convex punching faces, which are parts of a larger cylinder jacket concentric to the punching cylinder and, during each adhesion phase, roll on an impression cylinder and transfer the marks (3; 3') to the substrate (1). The band speed of the foil may also be less than the rate of advancement. A hot embossing foil having an adhesive layer or an embossing foil without adhesive layer may be used as the foil, the device for applying the embossing foil to the substrate (1) having an applicator unit for adhesive upstream of the adhesion station (11 or 11') and a radiating station for activating adhesive layers. <IMAGE>

IPC 1-7

B42D 15/02; B29C 65/00

IPC 8 full level

B65C 9/24 (2006.01); B41F 19/06 (2006.01); B42D 15/10 (2006.01)

CPC (source: EP US)

B41F 19/062 (2013.01 - EP US); B42D 25/00 (2014.10 - EP US); B42D 25/405 (2014.10 - EP US); B42D 25/425 (2014.10 - US); B41P 2219/51 (2013.01 - EP US); B42D 15/00 (2013.01 - US); B42D 25/29 (2014.10 - EP US); B42D 25/328 (2014.10 - EP US); B42D 25/455 (2014.10 - EP US); B42D 2033/04 (2022.01 - EP); B42D 2033/24 (2022.01 - EP); B42D 2033/30 (2022.01 - EP); B42D 2035/02 (2022.01 - EP); Y10T 156/1705 (2015.01 - EP US); Y10T 156/1707 (2015.01 - EP US); Y10T 156/1737 (2015.01 - EP US)

Designated contracting state (EPC)

AT CH DE DK FR GB IT LI

DOCDB simple family (publication)

EP 0433575 A1 19910626; EP 0433575 B1 19941221; EP 0433575 B2 19991006; AT E115916 T1 19950115; CA 2028649 A1 19910622; DE 59008083 D1 19950202; DK 0433575 T3 19950508; FI 906300 A0 19901220; FI 906300 A 19910922; JP H03200535 A 19910902; US 5207855 A 19930504

DOCDB simple family (application)

EP 90118271 A 19900924; AT 90118271 T 19900924; CA 2028649 A 19901026; DE 59008083 T 19900924; DK 90118271 T 19900924; FI 906300 A 19901220; JP 33091090 A 19901130; US 61863290 A 19901127