EP 0434113 A3 19920408 - ALLOYING LOW-LEVEL ADDITIVES INTO HOT-WORKED ND-FE-B MAGNETS
Title (en)
ALLOYING LOW-LEVEL ADDITIVES INTO HOT-WORKED ND-FE-B MAGNETS
Publication
Application
Priority
US 45343489 A 19891219
Abstract (en)
[origin: EP0434113A2] Diffusion-alloying techniques are used to introduce low quantities of powdered metal additives into hot-worked Nd-Fe-B magnets. The powdered metal is added to rapidly solidified ribbons of the magnetic alloy prior to hot working. Diffusion-alloying during hot-working permits the final chemistry of the magnet and more specifically the grain boundaries to be determined during the final processing steps. Elements which diffuse into the matrix, such as zinc, copper and nickel, enhance the coercivity by as much as 100 percent in die-upset magnets. At optimum levels, approximately 0.5-0.8 weight percent, the metal additives do not diminish the remanence or energy product of the magnet.
IPC 1-7
IPC 8 full level
C22C 1/04 (2006.01); C22C 33/02 (2006.01); C22C 38/00 (2006.01); H01F 1/053 (2006.01); H01F 1/057 (2006.01); H01F 41/02 (2006.01)
CPC (source: EP)
C22C 1/0441 (2013.01); H01F 1/0576 (2013.01)
Citation (search report)
- [Y] US 4881985 A 19891121 - BREWER EARL G [US], et al
- [A] DE 3839545 A1 19890608 - HITACHI METALS LTD [JP]
- [XP] US 4950450 A 19900821 - CHATTERJEE DILIP K [US], et al
- [Y] PATENT ABSTRACTS OF JAPAN vol. 13, no. 513 (E-847)(3861) 16 November 1989 & JP-1 208 813 ( MATSUSHITA ) 22 August 1989
- [A] PATENT ABSTRACTS OF JAPAN vol. 13, no. 97 (E-723)(3445) 7 March 1989 & JP-63 272 009
- [XP] APPLIED PHYSICS LETTERS. vol. 56, no. 22, May 1990, NEW YORK US pages 2252 - 2254; C.D FUERST ET AL: 'Enhanced coercivities in die -upset Nd-Fe-B magnets with diffusion-alloyed additives ( Zn,Cu, and Ni)'
Designated contracting state (EPC)
DE FR GB NL
DOCDB simple family (publication)
EP 0434113 A2 19910626; EP 0434113 A3 19920408; EP 0434113 B1 19940302; CA 2023924 A1 19910620; DE 69007048 D1 19940407; DE 69007048 T2 19940601; JP H03267346 A 19911128; JP H0739618 B2 19950501
DOCDB simple family (application)
EP 90203171 A 19901201; CA 2023924 A 19900823; DE 69007048 T 19901201; JP 40378690 A 19901219