Global Patent Index - EP 0436848 B1

EP 0436848 B1 19950524 - Matched impedance vertical conductors in multilevel metal dielectric laminated wiring.

Title (en)

Matched impedance vertical conductors in multilevel metal dielectric laminated wiring.

Title (de)

Impedanz-angepasste vertikalen leiter in einem Metall-Dielektrikum-Mehrschichtsubstrat.

Title (fr)

Conducteurs verticaux à impédance adaptée dans un substrat laminaire métal-diélectrique à multi-couches.

Publication

EP 0436848 B1 19950524 (EN)

Application

EP 90123638 A 19901208

Priority

US 46306890 A 19900110

Abstract (en)

[origin: EP0436848A2] Electrical impedance matching for through plane connections or vias (20-44) in a multiplane laminated wiring structure is provided by arranging the vias in patterns conforming to a standard characteristic impedance configuration. The pattern may be a five wire configuration with four vias surrounding the fifth and repeated over the area of the plane.

IPC 1-7

H01L 23/64; H01L 23/538; H01L 23/66

IPC 8 full level

H05K 3/46 (2006.01); H01L 23/12 (2006.01); H01L 23/538 (2006.01); H01L 23/64 (2006.01); H05K 1/02 (2006.01); H05K 1/00 (2006.01); H05K 1/11 (2006.01)

CPC (source: EP)

H01L 23/5384 (2013.01); H01L 23/64 (2013.01); H01L 23/66 (2013.01); H05K 1/0253 (2013.01); H01L 2223/6616 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/3011 (2013.01); H05K 1/0219 (2013.01); H05K 1/0222 (2013.01); H05K 1/0224 (2013.01); H05K 1/0289 (2013.01); H05K 1/115 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09681 (2013.01); H05K 2201/09718 (2013.01)

Citation (examination)

WO89/08326

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 0436848 A2 19910717; EP 0436848 A3 19911009; EP 0436848 B1 19950524; DE 69019713 D1 19950629; DE 69019713 T2 19960125; JP H03215995 A 19910920; JP H0716100 B2 19950222

DOCDB simple family (application)

EP 90123638 A 19901208; DE 69019713 T 19901208; JP 31301190 A 19901120